Combined Power and Cooling Rack for Data Center Heat Management
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Solution Overview
Problem
The increasing power dissipation of integrated circuit chips poses a cooling challenge in data centers, as traditional air-cooling methods become inadequate for managing high heat fluxes, especially in large server installations, leading to stress on room air-conditioning systems and limitations in airflow distribution.
Innovation Solution
A combined power and cooling apparatus that includes a frame with a bulk power assembly and a heat exchange assembly, providing both power and cooling to electronics racks by transferring heat from system coolant to facility coolant, thereby offloading power and cooling componentry to a dedicated rack, freeing space within electronics racks for additional subsystems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air-cooling methods are used to manage heat from integrated circuit chips, then cooling capability is sufficient for low power dissipation, but cooling effectiveness deteriorates when power dissipation increases to high levels
Solution Approach 1:
The patent replaces the mechanical air-cooling system with a liquid cooling system. Specifically, it uses liquid coolant circulating through cold plates attached to electronic components to transfer heat away from high-power dissipation devices, substituting the inadequate air convection mechanism with an efficient liquid heat transfer system
Solution Approach 2:
The patent implements a hydraulic cooling system using liquid coolant flowing through dedicated cooling channels and heat exchangers. The system employs pumps to circulate coolant through cold plates mounted on electronic components, utilizing fluid dynamics to efficiently remove heat from high-power devices
2Productivity
If more powerful air moving devices are used to increase airflow rates for cooling, then cooling capability improves, but device complexity and space requirements increase
Solution Approach 1:
The patent eliminates complex mechanical air moving devices (fans, blowers) by replacing them with a liquid circulation system. The cooling function is achieved through pumped liquid flow through heat exchangers, removing the need for high-RPM fans and associated mechanical complexity
Solution Approach 2:
The patent extracts the air moving devices from the cooling system entirely, separating the heat removal function from mechanical air movement. By taking out the fans and blowers, the system achieves cooling through liquid circulation, reducing mechanical complexity while maintaining or improving cooling capability
3Adaptability or versatility
If power and cooling components are integrated within electronics racks, then complete functionality is provided, but available space for compute elements is reduced
Solution Approach 1:
The patent segments the data center infrastructure into separate functional modules: electronics racks dedicated to compute elements, and separate power and cooling systems. This segmentation allows each rack to be optimized for its primary function while shared infrastructure provides supporting services, maximizing space utilization for compute elements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages high heat loads by consolidating power and cooling components, reducing the need for redundant systems and maximizing space within data center racks for compute elements, while maintaining reliable operation and efficiency.
Implementation Method 1
heat is transferred by the at least one heat exchange assembly from the system coolant to a facility coolant
Data Source
AI summary
A method is provided for facilitating powering and cooling of one or more electronics racks. The method includes: providing a frame; associating at least one bulk power assembly with the frame, the at least one bulk power assembly being configured to provide power to the electronics rack(s), wherein the frame with the associated one or more bulk power assemblies is distinct from the electronics rack(s); and associating one or more heat exchange assemblies with the frame, the heat exchange assembly(ies) being configured to cool system coolant provided to the electronics rack(s). In operation, heat is transferred by the heat exchange assembly(ies) from the system coolant to a facility coolant, and the frame with the associated bulk power assembly(ies) and associated heat exchange assembly(ies) provides both power and cooling to the electronics rack(s).