Combined Substrate Edge Trimming Using Reference Modification Layers
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Solution Overview
Problem
Conventional methods for edge trimming in combined substrates face challenges in accurately aligning laser light radiation devices due to discrepancies in the formation positions of modification layers and reduced bonding regions, leading to improper removal of peripheral portions in semiconductor wafer processing.
Innovation Solution
A processing method that forms a reference modification layer on the non-bonding surface of the first substrate, allowing for precise alignment of laser light radiation devices by using a micro camera with higher numerical aperture to determine the radiation positions for both interface and inside modifications, thereby ensuring accurate formation of non-bonding and peripheral modification layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser light radiation devices are used to form modification layers in combined substrates, then peripheral portion removal can be achieved, but misalignment between modification layers and radiation targets occurs leading to improper removal
Solution Approach 1:
The patent applies preliminary action by forming a reference modification layer on the non-bonding surface before performing the actual peripheral portion removal. This reference layer is created first to establish a precise alignment reference, and then the laser light radiation device uses this reference to accurately locate and form the peripheral modification layer, ensuring proper alignment and reliable removal without misalignment issues.
2Ease of manufacture
If modification layers are formed inside the substrate, then peripheral portion can be removed starting from the modification layer, but alignment accuracy decreases due to discrepancies in formation positions
Solution Approach 1:
The patent introduces an intermediary element - the reference modification layer formed on the non-bonding surface - that acts as a mediator between the laser light radiation device and the internal modification layer formation. This reference layer serves as a visible and measurable intermediary that enables precise alignment and positioning, allowing the device to accurately form the internal modification layer without position discrepancies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise alignment and removal of the peripheral portion of the first substrate, reducing the risk of misalignment and ensuring effective edge trimming in semiconductor wafer processing.
Implementation Method 1
forming a peripheral modification layer inside a first substrate along a boundary between a peripheral portion of the first substrate as a removal target and a central portion of the first substrate
Implementation Method 2
forming a non-bonding region in which bonding strength between the first substrate and the second substrate at the peripheral portion is reduced
Data Source
AI summary
A processing method of processing a combined substrate in which a first substrate and a second substrate are bonded to each other includes forming a peripheral modification layer along a boundary between a peripheral portion of the first substrate as a removal target and a central portion of the first substrate; forming a non-bonding region in which bonding strength between the first substrate and the second substrate at the peripheral portion is reduced; forming a reference modification layer, which serves as a determination reference of a formation position of either the peripheral modification layer or the non-bonding region, at a non-bonding surface of the first substrate not bonded to the second substrate; and removing the peripheral portion starting from the peripheral modification layer.