Combined Substrate Inspection With Selective Re-Measurement
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Solution Overview
Problem
Existing bonding systems face challenges in efficiently and accurately inspecting combined substrates for deviations between bonded semiconductor wafers, leading to potential defects and reduced throughput due to insufficient measurement accuracy and reliability.
Innovation Solution
A bonding system incorporating a controller with a measurement controller, comparison unit, and re-measurement controller to measure and re-measure substrates at varying numbers of points, using a control device to analyze deviation amounts and determine re-measurement needs, ensuring accurate inspection while maintaining throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of measurement points is increased to improve inspection accuracy, then measurement precision is improved, but inspection time increases and productivity decreases
Solution Approach 1:
The system performs inspection at a first number of measurement points (partial action) for all substrates, then selectively increases to a second number of measurement points (excessive action) only for substrates showing deviation in the first measurement, thereby achieving high inspection accuracy while maintaining overall productivity
2Reliability
If the number of measurement points is increased to improve reliability of inspection, then reliability is improved, but inspection time increases
Solution Approach 1:
The system applies full measurement (second number of points) selectively only when needed based on deviation detection in the first measurement, avoiding unnecessary time loss for substrates that do not require re-measurement while ensuring reliability for suspect cases
3Measurement precision
If measurement points are selectively increased for suspect substrates, then inspection accuracy is improved, but device complexity increases
Solution Approach 1:
The system dynamically adjusts the number of measurement points based on inspection results, transitioning from a first number of points for initial screening to a second number of points for re-measurement of suspect substrates, with the controller adaptively managing the inspection process
Solution Approach 2:
The system uses feedback from the first measurement (deviation detection) to control whether re-measurement with increased measurement points is performed, creating a closed-loop inspection process that improves accuracy while managing complexity
Data Source
AI summary
A bonding system includes a bonding device, an inspection device and a controller. The bonding device forms a combined substrate by bonding a first substrate and a second substrate to each other. The inspection device inspects the combined substrate. The controller controls the inspection device. The controller includes a measurement controller, a comparison unit and a re-measurement controller. The measurement controller causes the inspection device to measure the combined substrate at a first number of measurement points. The comparison unit compares, with a reference, an inspection result including a deviation amount between the first substrate and the second substrate in the combined substrate based on a measurement result. The re-measurement controller causes the inspection device to re-measure the combined substrate at a second number of measurement points greater than the first number of measurement points based on a comparison result obtained by the comparison unit.