Combined Temperature and Pressure Sensor with Bellows Isolation
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Solution Overview
Problem
Existing sensors for pressure and temperature measurement in applications like electric vehicles and liquid cooling systems are often bulky, costly, and lack sufficient media isolation, leading to inaccurate readings and potential damage from corrosive fluids.
Innovation Solution
A compact sensor apparatus featuring a media isolation chamber with a bellows member and insulator media, housing a MEMS pressure sensing element and temperature sensing element on a circuit board, providing separate outputs for pressure and temperature while isolating the sensing elements from corrosive media.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate pressure and temperature sensors are used, then measurement capability is provided, but device size and cost increase
Solution Approach 1:
The patent combines a pressure sensing element and a temperature sensing element into a single integrated sensor device. The pressure sensing element includes a diaphragm and piezoresistors for pressure detection, while the temperature sensing element uses a thermistor for temperature detection. Both sensing elements are housed together in a single package with shared circuitry, enabling simultaneous pressure and temperature measurement without requiring separate sensors, thus reducing device size and complexity.
2Measurement precision
If sensing elements are exposed to corrosive media, then direct measurement is achieved, but sensor accuracy deteriorates and damage occurs
Solution Approach 1:
The patent introduces a hermetically sealed enclosure as an intermediary barrier between the sensing elements and the corrosive media. The enclosure contains the pressure and temperature sensing elements in a protected environment, isolating them from direct contact with corrosive fluids while still allowing accurate measurement of the media's pressure and temperature. This hermetic barrier prevents chemical degradation and physical damage to the sensing elements, ensuring long-term reliability and measurement accuracy.
3Device complexity
If compact sensor design is implemented, then device size is reduced, but media isolation capability worsens
Solution Approach 1:
The patent employs a nested structure where the sensing elements are contained within a hermetically sealed enclosure that is itself housed within a compact external casing. The pressure sensing element with its diaphragm and the temperature sensing element with its thermistor are nested together in the same sealed environment. This nested arrangement provides effective media isolation through the hermetic barrier while maintaining a compact overall device footprint, resolving the contradiction between size reduction and protection capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution offers improved accuracy and protection of sensing elements from corrosive media, reducing thermal loss and providing a compact design suitable for applications in electric vehicles and liquid cooling systems.
Implementation Method 1
A compact sensor apparatus featuring a media isolation chamber with a bellows member and insulator media, housing a MEMS pressure sensing element and temperature sensing element on a circuit board, providing separate outputs for pressure and temperature while isolating the sensing elements from corrosive media.
Implementation Method 2
A compact sensor apparatus featuring a media isolation chamber with a bellows member and insulator media, housing a MEMS pressure sensing element and temperature sensing element on a circuit board
Data Source
Figure 1A
Figure 1B
Figure 2A
AI summary
Example methods, apparatuses and systems for a combined temperature and pressure sensing device are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.