Common Conductive Layer for Semiconductor Via Coupling

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing electronic component assemblies face challenges in efficiently coupling semiconductor dies across laminate electronic components, limiting their integration and functionality in applications like voltage regulators.

Innovation Solution

The assembly involves a first laminate electronic component with a semiconductor die and conductive via, and a second laminate electronic component with a semiconductor die and conductive via, where the vias are electrically coupled by a common conductive layer, allowing for secure and functional stacking and integration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If semiconductor dies are coupled across separate laminate electronic components, then integration and functionality are improved, but electrical coupling reliability and connection stability deteriorate

Engineering Contradiction:

Improveintegration and functionalityVSAvoidelectrical coupling reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

A common conductive layer is introduced as an intermediary element between the first and second conductive vias. This conductive layer extends into both vias, creating a reliable electrical coupling path that bridges the two laminate electronic components while maintaining connection stability and electrical reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The conductive vias from separate laminate components are merged through a common conductive layer, combining previously isolated electrical pathways into a unified conductive structure that ensures reliable signal and power transmission across component boundaries.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of manufacture

If conventional via coupling methods are used between laminate components, then manufacturing simplicity is maintained, but electrical connection stability and reliability deteriorate

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidelectrical connection stability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The common conductive layer serves as a mediator that bridges the vias from both laminate components, providing enhanced electrical connection stability while maintaining compatibility with existing manufacturing processes for conducting material deposition.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

Instead of relying solely on vertical via-to-via alignment, the solution extends the conductive path into a third dimension by introducing a common conductive layer that laterally connects the vias, thereby improving connection reliability without complicating the manufacturing approach.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If separate laminate electronic components are used, then design flexibility and functionality are improved, but device complexity and assembly difficulty increase

Engineering Contradiction:

Improvedesign flexibilityVSAvoidassembly difficulty

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The separate laminate components are merged through the common conductive layer that unifies their electrical pathways, reducing assembly complexity by creating a integrated structure while preserving the design flexibility of using multiple laminate layers.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The electronic component is segmented into multiple laminate layers that can be independently designed and manufactured, then assembled together with the common conductive layer providing the necessary electrical interconnections, thereby managing complexity through modular segmentation.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables effective electrical coupling and integration of semiconductor dies across laminate components, enhancing the performance and functionality of assemblies such as voltage regulators by providing reliable connections and compact designs.

Implementation Method 1

The first conductive via is electrically coupled to the second conductive via by a common conductive layer

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10257937B2Device for electrically coupling a plurality of semiconductor device layers by a common conductive layer

Publication Date: 2019.04.09 INFINEON TECH AUSTRIA AG

AI summary

An assembly includes a first laminate electronic component and a second laminate electronic component. The first laminate electronic component includes a first dielectric layer, at least one first semiconductor die embedded in the first dielectric layer and at least one first contact pad including a first conductive via. The second laminate electronic component includes a second dielectric layer, at least one second semiconductor die embedded in the second dielectric layer and at least one second contact pad including a second conductive via. The first conductive via is electrically coupled to the second conductive via by a common conductive layer.