Common Electrode Touch Structure With Fewer Mask Steps
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Solution Overview
Problem
Current electronic device manufacturing processes are limited by the high number of masks and steps, leading to increased costs, long lead times, and process complexity, which are not fully met by existing technologies.
Innovation Solution
The electronic device structure includes a substrate with a metal layer, insulating layers, and conductive layers, where a conductive pattern is electrically connected to both a sensing line and a touch electrode, reducing the number of masks and steps through a common electrode structure, allowing for pixel and touch signals to be in the same layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional separate electrode structures are used for sensing and touch functions, then functional reliability is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent combines sensing electrode and touch electrode into a single common electrode layer, eliminating the need for separate electrode structures. This merging reduces the number of manufacturing masks from multiple to two, simplifies the process steps, and reduces overall device complexity while maintaining both sensing and touch functions through a unified electrode structure
Solution Approach 2:
The common electrode layer serves multiple functions simultaneously - it acts as both the sensing electrode for detecting touch position and the touch electrode for detecting touch pressure. This multi-functional design allows a single electrode structure to perform what traditionally required separate dedicated structures, thereby reducing manufacturing complexity
2Manufacturing precision
If multiple masks and process steps are used in manufacturing, then manufacturing precision is improved, but productivity decreases and lead time increases
Solution Approach 1:
The patent merges the formation of sensing and touch electrodes into a single common electrode layer formation step. This consolidation reduces the number of photolithography masks from multiple individual masks to just two masks, thereby increasing manufacturing throughput and reducing lead time while maintaining adequate patterning precision for both electrode functions
3Reliability
If more process steps are implemented, then device reliability is improved, but loss of time increases
Solution Approach 1:
The patent combines multiple electrode formation steps into a single integrated process where the common electrode layer is formed in one step serving both sensing and touch functions. This merging eliminates redundant process steps, reducing manufacturing lead time while the resulting integrated structure maintains device reliability through proper electrical connections and insulation design
Data Source
AI summary
An electronic device and a forming method thereof are provided. The electronic device includes a substrate, a metal layer, a first insulating layer, a first conductive layer, a second insulating layer, and a second conductive layer. The metal layer is disposed on the substrate and includes a sensing line and a drain electrode. The first insulating layer is disposed on the metal layer. The first conductive layer is disposed on the first insulating layer and includes a touch electrode. The second insulating layer is disposed on the first conductive layer. The second conductive layer is disposed on the second insulating layer and includes a conductive pattern. The conductive pattern is electrically connected to the sensing line and the touch electrode.