Common Lead Frame Assembly for Low-Waste Semiconductor Packaging

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Solution Overview

Problem

Existing semiconductor manufacturing processes generate excessive waste and require multi-step processes due to the use of distinct lead frames for forming semiconductor components.

Innovation Solution

The semiconductor components are formed from a common lead frame, where a die attach pad and a source clip are initially connected, and the source clip is either cut and stacked with a die or folded over the die attach pad to provide electrical contact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If distinct lead frames are used for forming semiconductor components, then the components can be formed separately, but excessive waste material is generated

Engineering Contradiction:

Improvecomponent formationVSAvoidwaste material

Core Design Contradiction:

Ease of manufactureVSLoss of substance

Solution Approach 1:

The patent merges multiple separate lead frames into a single common lead frame structure. The source clip and gate clip are both formed from the same continuous conductive material, eliminating the need for separate lead frames and reducing material waste while maintaining the ability to form all necessary semiconductor components.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of manufacture

If distinct lead frames are used for forming semiconductor components, then each component can be formed independently, but the manufacturing process becomes multi-step

Engineering Contradiction:

Improvecomponent formationVSAvoidmanufacturing process

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent combines multiple manufacturing operations into a single integrated process. By forming the source clip and gate clip from one common lead frame, the manufacturing process is simplified from multiple separate steps into a unified process that produces all components simultaneously.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The common lead frame serves multiple functions: it forms both the source clip and gate clip, provides electrical connections, and supports the semiconductor die. This multi-functional structure eliminates the need for separate lead frames and simplifies the overall manufacturing process.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of manufacture

If separate lead frames are used, then component formation is simplified, but production costs increase

Engineering Contradiction:

Improvecomponent formationVSAvoidproduction cost

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The patent merges multiple lead frames into one common structure, reducing material costs and eliminating the need for separate manufacturing processes. This integration directly reduces production costs while maintaining the ability to form all necessary semiconductor components efficiently.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS20250062196A1Semiconductor device and method of forming components for semiconductor device

Publication Date: 2025.02.20 VISHAY SILICONIX LLC

AI summary

A semiconductor device and method of forming semiconductor components is disclosed herein. In one aspect, the semiconductor components are formed from a common lead frame in which a die attach pad and a source clip are initially connected to each other. Formation of the semiconductor can either include cutting the source clip from the die attach pad and then stacking a die therebetween, or folding the source clip over the die attach pad such that the source clip is folded over a die attached to the die attach pad.