Common Loader Layout for Compact Wire Bonding Equipment
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Solution Overview
Problem
Conventional wire bonding apparatuses have a long length, occupying a large area in semiconductor fabrication equipment, which decreases productivity.
Innovation Solution
A wire bonding apparatus with a common loader/unloader positioned at one side, allowing for a shorter length and reduced occupying area, while still capable of bonding conductive wires to multiple package substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a conventional wire bonding apparatus uses separate loaders and unloaders positioned at both sides of the bonder, then the loading and unloading operations can be performed independently, but the apparatus has a long length and occupies a large area
Solution Approach 1:
The patent combines the loader and unloader into a single integrated unit positioned at one side of the bonder. This common loader/unloader performs both loading and unloading operations, eliminating the need for separate loaders and unloaders at opposite sides, thereby reducing the apparatus length and occupying area while maintaining operational functionality
Solution Approach 2:
The common loader/unloader is designed to perform multiple functions - both loading package substrates onto the bonder and unloading processed substrates from it. This multi-functional design allows a single device to replace what were previously two separate devices, reducing the overall footprint of the wire bonding apparatus
2Ease of manufacture
If the wire bonding apparatus is arranged in a row with loader, bonder and unloader, then each component can be optimized independently, but the total length increases and productivity per area decreases
Solution Approach 1:
The patent reconfigures the spatial arrangement from a linear row configuration (loader-bonder-unloader in sequence) to a compact layout where the common loader/unloader is positioned at one side of the bonder. This dimensional reorganization reduces the apparatus length and increases the density of functional components, improving productivity per unit area
Data Source
AI summary
A wire bonding apparatus may include a bonder and a common loader/unloader. The bonder may bond a conductive wire to a plurality of package substrates. The common loader/unloader may load the package substrates into the bonder. The common loader/unloader may unload the package substrates from the bonder. Thus, an occupying area of the wire bonding apparatus in semiconductor fabrication equipment may be reduced to improve a productivity of the semiconductor fabrication equipment.