Common Mode Filter Coil Electrode Formation Without Build-Up Process
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Solution Overview
Problem
The existing manufacturing processes for common mode filters require repetitive build-up processes, leading to decreased productivity and increased costs due to the complexity of forming coil electrodes and external electrode terminals.
Innovation Solution
A common mode filter design that forms coil electrodes and external electrode terminals without a build-up process, using a core insulating layer with metal layers laminated on both surfaces, where the coil electrodes are formed by selective etching and connected via vias, and an external insulating layer covers the structure, eliminating the need for repetitive plating and application of insulating resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the build-up process is used to form coil electrodes and external electrode terminals, then the manufacturing precision is improved, but the productivity decreases and manufacturing costs increase due to repetitive plating and insulating resin application
Solution Approach 1:
The patent extracts the coil electrode formation process from the repetitive build-up process by directly forming coil electrodes on the insulating layer using a single plating step, eliminating the need for multiple repeated plating and insulating resin application cycles
Solution Approach 2:
The patent performs preliminary action by pre-forming the insulating layer with designated regions before electrode formation, allowing direct patterning of coil electrodes and external electrode terminals in subsequent steps without requiring iterative build-up processes
2Manufacturing precision
If the build-up process is used to form coil electrodes and external electrode terminals, then the manufacturing precision is improved, but the manufacturing cost increases due to multiple process steps
Solution Approach 1:
The patent extracts the electrode terminal formation from the iterative build-up process by directly forming both coil electrodes and external electrode terminals in separate single-step plating operations, eliminating repetitive processing cycles
Solution Approach 2:
The patent performs preliminary action by pre-defining regions for external electrode terminals on the insulating layer, enabling direct formation of these terminals without requiring multiple alignment and plating cycles
3Productivity
If metal layers are laminated on both surfaces of the core insulating layer, then the productivity is improved by reducing process number, but the device complexity increases due to additional etching steps
Solution Approach 1:
The patent segments the etching process into two distinct steps: half etching to expose metal layers in coil electrode regions, and selective etching to form external electrode terminals, thereby simplifying the overall process while maintaining productivity
Solution Approach 2:
The patent performs preliminary half etching to expose metal layers before selective etching, allowing subsequent steps to proceed more efficiently with reduced complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the number of manufacturing processes, enhancing productivity and lowering costs by directly patterning metal layers on the core insulating layer and forming external electrode terminals without additional etching steps.
Implementation Method 1
The coil electrodes formed on both surfaces of the core insulating layer may be connected to each other by a via penetrating through the core insulating layer
Data Source
AI summary
Disclosed herein are a method of manufacturing a common mode filter forming a coil electrode by directly patterning metal layers laminated on both surfaces of a core insulating layer while not using a build-up process, and the common mode filter manufactured according to the method.