Multi-Layer Common Mode Filter with Nested Coils
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Solution Overview
Problem
Existing common mode filters face challenges in miniaturization and improving impedance characteristics while maintaining noise removal performance, especially in the context of recent trends towards miniaturization and multi-functionalization of electronic components.
Innovation Solution
A common mode filter design featuring four or more coil layers, where primary and secondary coils are connected in series through internal or external terminals, and a discontinuous insulating part is used to connect coils across layers, allowing for reduced size and enhanced impedance characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of coil layers is increased to improve impedance characteristics, then noise removal performance is improved, but the size of the filter increases
Solution Approach 1:
The patent implements four or more coil layers nested vertically on top of each other, with each layer containing primary and secondary coils. The coils in upper layers are positioned to overlap with coils in lower layers when viewed from above, creating a compact vertical structure that improves impedance characteristics without proportionally increasing the horizontal footprint of the filter
Solution Approach 2:
The patent transitions from a planar two-dimensional layout to a three-dimensional vertical stacking arrangement. By arranging multiple coil layers in the vertical dimension rather than spreading them out horizontally, the patent achieves better impedance characteristics through increased coil density while maintaining a compact overall size
2Volume of moving object
If the filter is miniaturized to reduce size, then compactness is improved, but impedance characteristics deteriorate
Solution Approach 1:
The patent places four or more coil layers vertically nested within a compact housing, with each layer containing primary and secondary coils that overlap in planar projection. This nested arrangement allows the filter to maintain a small overall volume while achieving the necessary impedance characteristics through increased vertical coil density
Solution Approach 2:
The patent changes the spatial arrangement parameter from horizontal spreading to vertical stacking, and adjusts the coil configuration within each layer to optimize impedance. By modifying how the coils are positioned in three-dimensional space rather than simply reducing their dimensions, the patent achieves miniaturization without sacrificing impedance performance
3Reliability
If coils are connected through multiple layers using internal or external terminals, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent introduces internal terminals embedded within the coil layers and external terminals on the housing surface as intermediary connection points. These terminals serve as mediators that simplify the connection process between coils in different layers, allowing for reliable electrical connectivity while reducing manufacturing complexity compared to direct inter-layer connections
Solution Approach 2:
The patent divides the electrical connection system into discrete terminal segments - internal terminals within each coil layer and external terminals on the housing. This segmentation allows each terminal to be independently positioned and connected, simplifying the overall manufacturing process while ensuring reliable electrical connectivity across multiple layers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively miniaturizes the common mode filter while improving impedance characteristics, enabling better noise removal performance in compact electronic devices.
Implementation Method 1
A common mode filter having four coil layers or more, each layer including a primary coil and a secondary coil
Data Source
AI summary
Disclosed herein is a common mode filter including: at least four coil layers, each layer having a primary coil and a secondary coil; and discontinuous parts made of an insulating material each extending between starting points of each of the primary coil and the secondary coil positioned on the lowest layer among the coil layers to ending points of each of the primary coil and the secondary coil positioned on the highest layer among the coil layers. The primary coils are connected in series from the lowest layer to the highest layer, and the secondary coils are connected in series from the lowest layer to the highest layer. The common mode filter is able to be miniaturized and has improved impedance characteristics.