Common Mode Noise Filter With Overlapping Coils
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Solution Overview
Problem
Conventional common mode noise filters have imbalanced magnetic couplings between coils, leading to reduced impedance and effectiveness in eliminating common mode noise due to uneven coil dispositions, which affects the ability to suppress noise in electronic devices.
Innovation Solution
The design includes three independent coils with specific coil conductor configurations on insulating layers, where coils are positioned to ensure balanced magnetic couplings by being adjacent at multiple locations, with overlapping regions to enhance coupling strength and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If coils are disposed independently without overlapping, then manufacturing is simpler, but magnetic coupling becomes imbalanced and noise suppression effectiveness decreases
Solution Approach 1:
The patent transitions from planar coil arrangement to three-dimensional overlapping arrangement. First coil conductors are formed on a first insulating layer, while second coil conductors are formed on a second insulating layer that overlaps the first layer. This vertical stacking enables magnetic coupling between coils while maintaining compact form factor and achieving balanced impedance characteristics.
Solution Approach 2:
The patent implements nested coil structures where second coil conductors are positioned within the projected area of first coil conductors through overlapping insulating layers. This nesting approach allows multiple coils to occupy the same footprint area, achieving balanced magnetic coupling without increasing the overall device area, thus resolving the contradiction between noise suppression effectiveness and device compactness.
2Ease of manufacture
If coil conductors are sequentially stacked from bottom, then manufacturing is easier, but magnetic coupling between coils becomes imbalanced
Solution Approach 1:
The patent uses vertical stacking of insulating layers with coil conductors formed on different layers. First coil conductors are on the first insulating layer, and second coil conductors are on the second insulating layer that overlaps the first layer. This multi-layer configuration enables balanced magnetic coupling while maintaining a compact vertical profile, resolving the contradiction between manufacturing simplicity and coupling balance.
Solution Approach 2:
The patent creates different local configurations for different coil conductors. First coil conductors have a first pattern, while second coil conductors have a second pattern that overlaps the first pattern when projected. This local differentiation in conductor arrangement enables balanced magnetic coupling between coils while maintaining overall manufacturing feasibility through standardized layering processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves balanced magnetic couplings between coils, improving the common mode noise filter's ability to suppress noise effectively, making it suitable for compact, slim applications in electronic devices.
Implementation Method 1
a first coil including a first coil conductor and a second coil conductor... a second coil including a third coil conductor and a fourth coil conductor... a third coil including a fifth coil conductor and a sixth coil conductor
Data Source
AI summary
A common mode noise filter of the present disclosure includes: a first insulating layer; a second insulating layer formed under the first insulating layer; a first coil including a first coil conductor and a second coil conductor, the first coil conductor being electrically connected to the second coil conductor; a second coil including a third coil conductor and a fourth coil conductor, the third coil conductor being electrically connected to the fourth coil conductor; and a third coil including a fifth coil conductor and a sixth coil conductor, the fifth coil conductor being electrically connected to the sixth coil conductor. Further, the first coil conductor, the third coil conductor, and the fifth coil conductor are sequentially formed on the first insulating layer from the outer side. The sixth coil conductor, the fourth coil conductor, and the second coil conductor are sequentially formed on second insulating layer from the outer side.