Common Rail Cooling Plate for Uniform Electronic Component Cooling
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Solution Overview
Problem
Existing cooling systems provide uneven cooling for electronic components due to varying coolant flow and temperature distribution, leading to some components being overheated while others remain cooler.
Innovation Solution
A cooling device with a common rail configuration and serpentine passageways ensures equal coolant distribution by maintaining a pressure differential, allowing coolant to flow at a consistent velocity through parallel cooling units, ensuring each component is evenly cooled.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling loops are used with coolant flowing from inlet to outlet, then cooling is provided to electronic components, but uneven cooling occurs with temperature variance up to 17.4°C across components
Solution Approach 1:
The cooling chamber is segmented into multiple cooling units (first, second, third, fourth cooling units) arranged in parallel between the common rail and collection cavity. Each cooling unit independently cools a specific region, ensuring uniform temperature distribution across all electronic components without the temperature variance that occurs in sequential cooling loops
Solution Approach 2:
Each cooling unit is positioned to cool a specific local region where electronic components are mounted. The common rail distributes coolant equally to all cooling units, providing locally optimized cooling where needed most, rather than relying on coolant temperature progression that causes uneven cooling across different locations
2Temperature
If coolant flows through sequential cooling pathways, then heat is absorbed from electronic components, but components closer to inlet receive lower temperature coolant while components at the end receive warmer coolant
Solution Approach 1:
The common rail is designed to maintain equal pressure and flow distribution to all cooling units, creating an equipotential system where coolant flows equally to each parallel cooling unit. This eliminates the temperature gradient that occurs in sequential flow paths, ensuring all electronic components receive coolant at the same temperature for uniform cooling effectiveness
3Quantity of substance
If multiple cooling loops are used to cover all electronic components, then more components can be cooled, but flow splits become uneven causing some pathways to receive more coolant than others
Solution Approach 1:
The cooling system is divided into multiple independent parallel cooling units, each with its own dedicated flow path from the common rail to the collection cavity. This segmentation prevents flow interference between pathways and ensures equal coolant distribution to each unit, achieving both comprehensive coverage and flow uniformity
Solution Approach 2:
The system changes the flow configuration from sequential to parallel, and maintains equal pressure parameters in the common rail to ensure uniform coolant distribution across all cooling units. This parameter optimization ensures each cooling unit receives equal flow regardless of pathway length or resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform heat dissipation across electronic components, reducing temperature variance by up to 17.4°C compared to conventional systems, enhancing cooling efficiency and component longevity.
Implementation Method 1
the common rail, plurality of cooling units and collection cavity are configured such that a pressure of a coolant fluid within the common rail is higher than a pressure of a coolant fluid within the collection cavity, and the coolant fluid flows into each of the plurality of cooling units at a generally equal velocity
Implementation Method 2
Cooling plate 20 includes a first surface 12 and a second surface 14. Cooling chamber 22 is adjacent to first surface 12. While flowing through passageway 42, the coolant absorbs heat through first surface 12 from the electrical components coupled to second surface 14, thereby cooling the electrical components
Data Source
AI summary
A cooling plate assembly to facilitate the cooling of electronic components, the cooling plate assembly including a cooling plate and a cooling chamber. The cooling chamber comprising a surface configured to receive a component to be cooled, a cooling chamber inlet, a common rail, a collection cavity, a plurality of cooling units fluidly coupled between the common rail and collection cavity, and a cooling chamber outlet fluidly coupled to the collection cavity.