Common RF Filter for Substrate Stage Heater Control
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Solution Overview
Problem
The existing substrate processing apparatuses face challenges in achieving temperature uniformity and miniaturization due to the increasing number of independently temperature-controlled regions, which results in a larger size and complexity, especially with the need for multiple RF filters for each heating region.
Innovation Solution
A substrate processing apparatus with a stage that includes a conductor base, electrostatic chuck, heaters, and a common RF filter for all heaters, where resistors are used to measure temperature and correct for differences between surface and measured temperatures, allowing for precise temperature control and reducing the apparatus size by eliminating the need for individual RF filters for each heating region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple RF filters are provided for each heating region to enable independent temperature control, then temperature control precision is improved, but device complexity and size increase
Solution Approach 1:
The patent merges multiple RF filters into a single common RF filter that serves all heating regions simultaneously. The RF filter is configured to filter RF noise from the power supply lines for multiple heaters, eliminating the need for individual RF filters for each heating region. This reduces device complexity and size while maintaining temperature control precision through the shared filtering capability.
Solution Approach 2:
The common RF filter is designed to perform the RF noise filtering function for all heating regions universally. Instead of dedicating one RF filter per heater, the single RF filter handles power supply conditioning for multiple heaters, demonstrating multi-functionality that reduces overall device complexity while preserving independent temperature control capabilities.
2Temperature
If multiple RF filters are provided for each heating region, then temperature uniformity across regions is improved, but the apparatus size increases
Solution Approach 1:
The patent combines multiple individual RF filters into one common RF filter unit that serves all heating regions. This spatial consolidation reduces the total area occupied by RF filtering components while maintaining the ability to provide clean power to each heater independently, thus preserving temperature uniformity across different regions of the substrate.
3Reliability
If individual RF filters are used for each heater, then reliability of temperature control is improved, but ease of manufacture deteriorates
Solution Approach 1:
The patent merges multiple RF filter functions into a single integrated component, simplifying the manufacturing process. Instead of procuring, testing, and assembling multiple individual RF filters, the system uses one common RF filter that is easier to manufacture and install. This maintains temperature control reliability by ensuring consistent power supply conditioning across all heaters while reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise temperature control and reduces the size of the substrate processing apparatus by using a common RF filter and thermistors to accurately measure and correct temperature differences, improving temperature uniformity while minimizing the apparatus's footprint.
Implementation Method 1
an RF filter connected to a wiring for supplying electric power from outside the base to each heater, and provided in common for the plurality of heaters
Implementation Method 2
resistors are used to measure temperature and correct for differences between surface and measured temperatures
Implementation Method 3
a plurality of heaters provided in the substrate holding part
Data Source
AI summary
A substrate processing apparatus for processing a substrate using plasma includes a chamber in which the substrate is accommodated, and a stage arranged inside the chamber and configured to mount the substrate thereon. The stage includes: a base formed by a conductor and configured to allow RF (Radio Frequency) power to flow through the conductor; a substrate holding part provided on the base and configured to hold the substrate; a plurality of heaters provided in the substrate holding part; a heater control part provided inside the base and configured to control electric power to be supplied to each of the plurality of heaters; and an RF filter provided outside the base and connected to a wiring for supplying the electric power to each of the plurality of heaters. The RF filter is provided in common for the plurality of heaters.