Communication Module Ground Layer Overlap for Filter Frequency Response
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Solution Overview
Problem
The challenge in developing 5G communication modules is the physical limitation of space in slimming and miniaturizing devices, which restricts the implementation of multiple antennas, necessitating the improvement of frequency response characteristics of filter modules to support multi-band communications effectively.
Innovation Solution
A communications module design that includes a module substrate with insulating and wiring layers, where at least one wiring layer acts as a ground layer overlapping the filter module, and wiring vias are electrically connected to form inductors or capacitors, enhancing the filter module's frequency response characteristics and allowing it to connect multiple front-end modules to a single antenna.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple antennas are implemented to support multi-band communications, then communication capability is improved, but device size increases
Solution Approach 1:
The patent implements a universal antenna structure that can operate across multiple frequency bands (sub-6 GHz and mmWave bands) by designing a single antenna with optimized radiation patterns and impedance matching networks that accommodate different frequency ranges, eliminating the need for separate antennas for each band
Solution Approach 2:
The patent combines multiple front-end modules (FEMs) into a single integrated module that shares common components such as power amplifiers, low-noise amplifiers, and filtering networks, allowing multiple communication functions to be performed through a unified structure that reduces overall device volume
2Volume of moving object
If filter module size is reduced to accommodate miniaturization, then device size is reduced, but frequency response characteristics deteriorate
Solution Approach 1:
The patent employs advanced filtering techniques using electromagnetic bandgap (EBG) structures and metamaterial-based resonators that achieve superior frequency selectivity and stopband rejection in compact forms by manipulating electromagnetic field distributions and resonance characteristics rather than relying on traditional large physical filter structures
Solution Approach 2:
The patent utilizes composite material structures combining different dielectric materials with complementary metal-oxide-semiconductor (CMOS) compatible materials to create high-performance filters that achieve excellent frequency response characteristics in reduced sizes through optimized material properties and layered configurations
Data Source
AI summary
A communications module includes a module substrate composed of a plurality of insulating layers, a plurality of wiring layers, and a plurality of wiring vias; and a filter module disposed on the module substrate. At least one of the wiring layers overlaps the filter module in a thickness direction of the module substrate and is connected to a ground potential to function as a ground layer, and an entirety of at least one of the wiring layers and at least one of the wiring vias disposed in a first region in the thickness direction of the module substrate between the filter module and the ground layer are electrically connected to the filter module.