Communication Module Self-Diagnosis for Signal Path Failure Detection
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Solution Overview
Problem
Current methods for detecting communication circuit failures in electronic devices require external measuring equipment, leading to inefficiencies in manufacturing and increased production costs due to the need for assembly and disassembly, as well as the requirement for expensive testing tools.
Innovation Solution
An electronic device is designed with internal components such as connectors, signal paths, antenna ports, and a communication module that allows for the detection of signal path failures without external equipment, using signal amplification and filtering to determine failure based on transmission signal information.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external measuring equipment is used to detect communication circuit failures, then detection accuracy is improved, but device complexity and production cost increase
Solution Approach 1:
The electronic device performs self-diagnosis by using its own communication module to transmit test signals through its internal signal paths and antennas. The device monitors its own transmission and reception capabilities without requiring external measuring equipment, thereby achieving detection accuracy while eliminating the need for complex external devices.
Solution Approach 2:
The patent introduces a test signal as an intermediary to facilitate self-detection. The communication module transmits test signals that serve as mediators to probe the integrity of signal paths, amplifiers, and antennas, enabling the device to detect failures without direct external measurement instruments.
2Difficulty of detecting and measuring
If external measuring equipment is used for failure detection, then detection capability is improved, but manufacturing efficiency deteriorates due to assembly and disassembly requirements
Solution Approach 1:
The self-detection function is integrated into the communication module before final assembly is completed. By performing detection operations during the manufacturing process itself, the system identifies failures early without requiring subsequent disassembly for testing, thereby maintaining detection capability while improving manufacturing efficiency.
Solution Approach 2:
The electronic device autonomously performs detection operations during manufacturing without requiring external equipment attachment or disassembly. The communication module executes self-tests on its own components, eliminating the need for repeated assembly and disassembly cycles and thereby improving productivity.
3Measurement precision
If external measuring equipment is used to detect communication circuit failures, then detection accuracy is improved, but production cost increases due to expensive testing tools
Solution Approach 1:
The electronic device uses its own communication module and existing hardware components to perform self-detection, eliminating the need to purchase and maintain expensive external measuring equipment. This self-service approach maintains detection accuracy while significantly reducing production costs.
Solution Approach 2:
The communication module serves multiple functions: it performs both normal communication operations and self-detection of signal path failures. By making the communication module multi-functional, the system eliminates the need for separate expensive testing equipment while maintaining detection capabilities.
4Reliability
If communication circuit failure is detected after assembly, then detection thoroughness is improved, but manufacturing efficiency deteriorates due to required separation for repair
Solution Approach 1:
The self-detection function is executed during the manufacturing process before final assembly and shipment. By performing thorough detection of signal paths, amplifiers, and antennas early in the process, the system identifies failures before they require post-assembly separation and repair, thereby maintaining detection thoroughness while improving manufacturing efficiency.
Solution Approach 2:
The communication module continuously monitors its own operation and provides feedback on the status of signal paths and components. This real-time feedback mechanism enables thorough detection of failures during manufacturing without requiring subsequent disassembly, as issues are identified and flagged immediately when they occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the detection of communication circuit failures internally, reducing production costs and improving manufacturing efficiency by eliminating the need for external testing equipment and allowing for pre-assembly failure detection.
Implementation Method 1
a first signal path including an amplifier configured to amplify a signal to be transmitted to the outside of the electronic device
Implementation Method 2
an antenna port electrically connected to the first signal path and the second signal path via a filter circuit
Data Source
AI summary
Provided are an electronic device for determining failure of a signal path and a component, and a method for operating the electronic device according to various embodiments. The electronic device comprises: at least one connection part for connection to an external device; a first signal path including an amplifier for amplifying a signal transmitted to the outside of the electronic device; a second signal path for obtaining another signal from the outside of the electronic device; an antenna port electrically connected to the first signal path and the second signal path through a filter circuit; and a communication module, wherein the communication module may be configured to transmit a transmission signal through the first signal path to the antenna port, obtain at least a part of the transmission signal through the second signal path, and determine whether the electronic device is defective on the basis of the transmission signal and information associated with at least a part of the transmission signal. Various other embodiments are possible.