Communication Module Vertical Stacking Heat Radiation Frames

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Solution Overview

Problem

Existing communication modules face challenges in minimizing their size while accommodating various communication devices, leading to increased overall size due to horizontal arrangement of components on a single surface.

Innovation Solution

The communication module design features a module substrate with communication elements mounted on both sides, utilizing heat radiation frames and thermal interface materials to manage heat and electromagnetic interference, and includes external connection electrodes to facilitate vertical arrangement of components, thereby minimizing the module's size and enhancing heat radiation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If communication devices are arranged horizontally on one surface of the unit substrate, then each device can be properly mounted and connected, but the overall size (area) of the communication module increases

Engineering Contradiction:

Improvemounting and connection of communication devicesVSAvoidoverall size of communication module

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent transitions from a two-dimensional horizontal arrangement of communication devices on a single surface to a three-dimensional configuration by stacking devices vertically across multiple surfaces (first and second surfaces) of the unit substrate. This dimensional change allows multiple communication devices to be mounted in different vertical layers, significantly reducing the horizontal footprint and overall area of the module while maintaining proper mounting and electrical connections through vertically extending connection structures

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If multiple communication devices are mounted on both surfaces of the module substrate, then the module size is minimized through vertical arrangement, but heat management and electromagnetic interference become more complex

Engineering Contradiction:

Improvemodule sizeVSAvoidheat management and electromagnetic interference control

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent divides the internal space of the communication module into separate compartments or regions using partition walls or shielding structures. This segmentation isolates different communication devices mounted on opposite surfaces, preventing electromagnetic interference between them while also creating distinct thermal zones for more effective heat management. Each segmented region can be independently controlled or cooled, reducing the overall complexity of managing multiple devices in close proximity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces intermediary structures such as shielding plates, ground planes, or isolation layers positioned between communication devices mounted on different surfaces. These intermediary elements act as mediators that block or redirect electromagnetic fields, preventing interference between adjacent devices. They also serve as thermal management interfaces, facilitating heat transfer from high-power devices to heat sinks or cooling structures, thereby simplifying the overall heat management system

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively reduces the size of the communication module by vertically arranging components and improves heat radiation efficiency, while also blocking electromagnetic interference, resulting in lower temperatures and enhanced performance compared to traditional designs.

Implementation Method 1

A thermal interface material (TIM) may be interposed between the cover and the at least one of the one or more first communication elements, and may be configured to transfer heat generated in the at least one of the one or more first communication elements to the cover.

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS10999957B2Communication module and mounting structure thereof

Publication Date: 2021.05.04 SAMSUNG ELECTRO MECHANICS CO LTD

AI summary

A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.