Communication Module With Thin Outer Insulation Layers
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Solution Overview
Problem
In communication modules, especially in portable telephone equipment, acoustic wave filters and duplexers face challenges in integration due to electromagnetic coupling between closely arranged electric lines, leading to degradation in suppression and isolation performance.
Innovation Solution
The communication module is designed with a laminate structure of metal and insulation layers, where the outermost insulation layers on both the package and module substrates are thinner than the other layers, and a ground pattern is provided on the back face to direct electric fields to ground, reducing electromagnetic coupling and enhancing suppression and isolation characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electric lines are arranged closely in the package substrate and module substrate to achieve downsizing, then the module size is reduced, but unnecessary electromagnetic coupling occurs between the electric lines, degrading suppression and isolation performance
Solution Approach 1:
The patent applies local quality by making the outermost insulation layer thickness different from other insulation layers. Specifically, the outermost insulation layer has a thickness of 0.05 to 0.20 times that of other insulation layers, creating a localized thin region at the mounting surface that reduces electromagnetic coupling between closely arranged electric lines while maintaining overall structural integrity
Solution Approach 2:
The patent changes the thickness parameter of the outermost insulation layer to resolve the contradiction. By reducing the outermost insulation layer thickness to 0.05 to 0.20 times that of other insulation layers, the design enables closer electric line arrangement (reducing module size) while controlling electromagnetic coupling through the optimized insulation thickness parameter
2Object-affected harmful factors
If the outermost insulation layer is made thinner to reduce electromagnetic coupling, then suppression and isolation performance is improved, but the mechanical strength of the substrate may be compromised
Solution Approach 1:
The patent applies local quality by creating a thin outermost insulation layer only at the mounting surface where electric lines are located, while other insulation layers maintain normal thickness to provide mechanical strength. This localized thinning reduces electromagnetic coupling without compromising overall substrate strength
Solution Approach 2:
The patent uses a composite laminate structure with multiple insulation layers of different thicknesses. The outermost layer is thin (0.05 to 0.20 times other layers) for electromagnetic coupling control, while underlying layers provide mechanical support, creating a composite structure that balances electrical performance and mechanical strength
3Object-affected harmful factors
If multiple insulation layers with different thicknesses are used to optimize performance, then electromagnetic coupling is reduced, but the manufacturing complexity and number of laminating steps increase
Solution Approach 1:
The patent applies local quality by varying the thickness of only the outermost insulation layer while keeping other insulation layers at standard thickness. This selective differentiation achieves electromagnetic coupling control without requiring all layers to be custom-designed, thereby limiting the increase in manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces unnecessary electromagnetic coupling, improving the suppression and isolation performance of the module while allowing for downsizing and cost reduction through thinner substrates and fewer laminating steps, resulting in a more efficient and cost-effective communication module.
Implementation Method 1
unnecessary electromagnetic coupling tends to occur between the electric lines
Data Source
AI summary
A communication module includes a filter element, a package substrate on which the filter element is mounted, and a module substrate on which the package substrate is mounted. Each of the package substrate and the module substrate is formed of a laminate of a plurality of metal layers and a plurality of insulation layers. An outermost insulation layer forming a mounting surface of the package substrate that is a surface on which the filter element is mounted has a thickness smaller than a thickness of at least one of the other insulation layers included in the package substrate. An outer insulation layer forming a mounting surface of the module substrate that is a surface on which the package substrate is mounted has a thickness smaller than a thickness of at least one of the other insulation layers included in the module substrate.