Comolded Inspection Feature for Adhesive Bond Quality
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Solution Overview
Problem
Existing methods for inspecting adhesive bond lines struggle to distinguish between actual voids and noise in inspection data, making it challenging to ensure the quality of the bond line, especially at structural locations.
Innovation Solution
An inspection feature with a predetermined bond line thickness and density is integrated into the component, mimicking defects to enhance non-destructive inspection scans, allowing for accurate differentiation between voids and noise and setting a standard for bond line evaluation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional bond bumps or ridges are used to mechanically set minimum bond line thickness, then the bond line thickness can be controlled, but the ability to distinguish actual voids from noise in inspection data is insufficient
Solution Approach 1:
The patent applies the copying principle by creating inspection features that replicate the density characteristics of actual defects (voids, gaps, cracks) within the adhesive bond portion. These copied defect features are embedded at known locations and serve as reference standards, allowing inspectors to compare unknown anomalies against these replicated defect patterns to accurately distinguish real defects from inspection noise.
Solution Approach 2:
The patent utilizes parameter changes by varying the density of inspection features to match specific defect types. By controlling the density parameter of the inspection features (made from materials like foam, aerogel, or hollow structures) to correspond to the density of actual defects, the inspection system can differentiate between different defect severities and types based on density-based imaging responses.
2Reliability
If multiple inspection methods (UT, CAT Scan, X-Ray) are used to inspect the bond line, then inspection coverage is improved, but setting an appropriate threshold to discern voids from noise becomes challenging
Solution Approach 1:
The patent applies universality by designing inspection features that function across multiple inspection methodologies (ultrasonic testing, CAT scanning, and X-ray imaging). The same density-based inspection feature serves as a reference standard for all three inspection types, providing a universal threshold reference that simplifies the inspection process despite using multiple complex inspection methods.
Solution Approach 2:
The inspection features act as intermediary reference standards between the inspection equipment and the actual defects. These features provide a known reference point that mediates the interpretation of inspection data, allowing the system to establish thresholds and criteria for distinguishing defects from noise across different inspection modalities without requiring complex analysis for each method.
3Manufacturing precision
If bond bumps are machined or molded into parts to control bond line thickness, then mechanical thickness control is achieved, but the inspection process becomes more complex at structural locations
Solution Approach 1:
The patent merges two previously separate functions into a single integrated feature: the bond bump that controls minimum bond line thickness and the inspection reference feature. By combining the thickness-setting function with the defect-differentiation function in one element, the system eliminates the need for separate inspection references, thereby reducing inspection process complexity while maintaining manufacturing precision.
Solution Approach 2:
The inspection feature serves multiple functions simultaneously: it acts as a mechanical stop to define minimum bond line thickness (like a traditional bond bump) and as a density-based reference standard for defect inspection. This multi-functionality reduces the overall complexity of the inspection process by eliminating the need for separate reference standards.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the inspection process by providing a calibration standard that helps differentiate between actual defects and noise, ensuring accurate bond line evaluation and minimizing void formation, while also serving as a non-destructive inspection standard for various scanning methods.
Implementation Method 1
the inspection feature having a density configured to imitate a defect of the adhesive bond portion responsive to a non-destructive inspection scan
Data Source
AI summary
An inspection feature for an adhesive bond portion between parts of a component comprising the inspection feature extending from a surface of the part of the component a predetermined bond line thickness, the inspection feature having a density configured to imitate a defect of the adhesive bond portion responsive to a non-destructive inspection scan.