Compact Connector Assembly With Solder Overflow Prevention
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Solution Overview
Problem
Existing connector assemblies face challenges in miniaturization due to issues such as cold soldering, warpage, solder overflow, and increased difficulty in soldering work, leading to electrical interference and reduced manufacturing convenience.
Innovation Solution
A connector assembly design featuring a zigzag arrangement of contacts with alternating shapes and elastic deformation, coupled with solder overflow preventers, to minimize gaps and maintain contact reliability while reducing size and improving manufacturing ease.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of contacts increases to maintain functionality, then the connector can support more connections, but the length becomes excessively long causing cold soldering and warpage
Solution Approach 1:
The patent transitions from a linear arrangement of contacts to a two-dimensional matrix array, allowing contacts to be organized in rows and columns. This dimensional change enables multiple contacts to be packed into a compact area, reducing the overall connector length while maintaining the required number of contact points.
Solution Approach 2:
The patent implements a nested structure where the insulator body contains embedded contact points arranged in multiple layers and dimensions. The contacts are integrated within the insulator structure rather than extending linearly, allowing the connector to maintain a compact form factor while supporting multiple connections.
2Volume of moving object
If the connector size is reduced for miniaturization, then the connector becomes more compact, but the gap between contacts decreases making soldering difficult and causing electrical interference
Solution Approach 1:
The patent applies different structural characteristics to different regions of the connector. The insulator material properties, contact spacing, and protective structures are optimized locally at each contact point to ensure adequate soldering access and prevent electrical interference, while the overall connector maintains a compact size through efficient spatial arrangement.
Solution Approach 2:
The patent introduces protective structures such as solder masks or barrier elements between adjacent contacts. These intermediary features prevent solder from bridging between contacts during the soldering process, eliminating electrical interference while allowing contacts to be positioned closer together for miniaturization.
3Volume of moving object
If the connector thickness is reduced for miniaturization, then the connector becomes thinner, but solder overflow occurs causing defects
Solution Approach 1:
The patent incorporates preventive features such as solder barriers, overflow grooves, or restricted solder access structures that are built into the connector design before soldering occurs. These preliminary protective measures prevent solder from overflowing onto adjacent contacts or circuit board areas, eliminating defects while allowing the connector to be manufactured with reduced thickness for miniaturization.
4Length of moving object
If two or more pairs of connectors are used instead of one to avoid excessive length, then the functionality is maintained, but the number of workers required for assembly increases
Solution Approach 1:
The patent combines multiple contact functions into a single integrated connector unit with a matrix array of contacts. Instead of requiring multiple separate connector pairs, one compact connector with organized rows and columns of contacts can perform the same connection function, reducing the number of assembly operations and improving productivity.
Data Source
AI summary
A connector and a connector assembly including the same are disclosed. The connector and the connector assembly including the same according to an aspect of the present disclosure is configured such that an interior solder overflow preventer of the connector may be accommodated in a displacement space of a counterpart connector.