Compact Semiconductor Device Transport Recess Integration
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Solution Overview
Problem
Conventional semiconductor manufacturing systems with long transport rails are inflexible, costly, and inefficient for small-volume, multi-kind production, particularly in ultra-compact setups like minimal fabs, due to complexity, instability, and increased size and cost, which complicates the transportation of small-diameter wafers and leads to positioning difficulties and reduced accuracy.
Innovation Solution
A compact manufacturing device with a housing that includes a recess for a container transport path between adjacent devices, allowing for integral, detachable container transport means within the housing, enabling efficient and flexible transport of substrate containers between adjacent compact manufacturing devices, reducing transport time and eliminating the need for extensive transport rails.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If one set of transport rails is arranged over the overall length of the production line to transport wafer containers among multiple semiconductor manufacturing devices, then automatic transport between devices is enabled, but the transport system becomes complicated, delicate and unstable due to difficulty in adjusting positions of the transport rail and devices
Solution Approach 1:
The patent divides the production line into segments where each semiconductor manufacturing device is independently positionable. Instead of one long fixed transport rail, the system uses multiple shorter transport rails that can be independently adjusted and positioned relative to each device, allowing local optimization and reducing cumulative positioning errors.
Solution Approach 2:
The patent introduces dynamic positioning capabilities where the positions of both the transport rails and semiconductor manufacturing devices can be adjusted. This includes movable support structures and positioning mechanisms that allow adaptation to floor irregularities and device placement variations, transforming a static rigid system into a flexible adaptive one.
2Area of stationary object
If one set of transport rails is used for multiple semiconductor manufacturing devices, then the transport system covers the entire production line, but the size of the transport system increases and the cost thereof increases
Solution Approach 1:
The transport system is segmented into multiple independent or semi-independent modules, each serving a local area between adjacent devices. This reduces the complexity of any single transport mechanism while collectively covering the entire production line through coordinated operation of multiple segments.
Solution Approach 2:
The patent combines the transport function with the device housing structure itself. The transport rails are integrated into or mounted on the device housings, and the housing structures serve dual purposes as both protective enclosures and transport support elements, reducing redundant structures.
3Ease of operation
If semiconductor manufacturing devices are positioned away from the transport rail, then positioning becomes more difficult and a greater allowable range is needed, but this complicates the transport system and requires additional mechanisms such as ceiling-mounted transport
Solution Approach 1:
The patent implements dynamic positioning systems with adjustable ranges that adapt to the actual distance between devices and transport rails. Positioning mechanisms can extend or retract, and the system automatically adjusts its operational parameters based on measured distances, eliminating the need for excessive design margins.
Solution Approach 2:
The patent replaces complex mechanical positioning systems with sensor-based detection and control systems. Optical sensors, encoders, or other detection mechanisms measure positions and distances, and computer control algorithms calculate and execute the necessary adjustments, replacing purely mechanical linkages and adjustment mechanisms.
4Stability of the object's composition
If transport rails are fixed to ceiling or floor, then the transport system provides stable support, but there is basically no flexibility in the positions of the transport rails
Solution Approach 1:
The patent transforms fixed transport rails into dynamically adjustable ones. This includes movable mounting structures that can slide or reposition along the ceiling or floor, adjustable support legs or brackets, and motorized positioning systems that allow the rails to be relocated to optimal positions for different device configurations.
Solution Approach 2:
The patent enables changes in key parameters of the transport rail system such as position, orientation, and height. This is achieved through adjustable mounting mechanisms, telescopic sections, and reconfigurable support structures that allow the system to adapt to different production line layouts and device positions while maintaining operational stability.
Data Source
Figure 1A
Figure 1B
AI summary
[Problem to be Solved] To automatically transport a wafer transport container between compact manufacturing devices in a production line made up of a plurality of compact manufacturing devices such as semiconductor manufacturing devices. [Solution] The production line 1 is formed by arranging three compact semiconductor manufacturing devices 2 in parallel in a straight line on a floor surface 16. The semiconductor manufacturing devices 2 each have a substantially rectangular parallelepiped housing 3, and a processing chamber 5 and a device front chamber 6 are arranged inside each housing 3. Recesses 7 are formed above the device front chambers 6 in the front portions of the housings 3. Container mounting tables 9 and temporary placement trays 8 are installed in the recesses 7, and container transport means 12 are integrally provided. This makes it possible to automatically transport a wafer transport container 10 between the three semiconductor manufacturing devices 2. As a result, it is possible to efficiently advance a series of manufacturing processes for a semiconductor wafer.