Compact EBG Structure for High-Frequency Noise Suppression
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Solution Overview
Problem
Conventional EBG structures for suppressing electromagnetic noise are too large and not compact enough to effectively address noise issues in modern electronic devices, particularly in high-frequency bands used for radio communication.
Innovation Solution
A compact EBG structure is achieved by arranging first and second conductor planes with transmission lines in different layers, connected via conductors, and incorporating slits on the second conductor plane to intersect with the transmission lines, functioning as open stubs and inductance imparting members to reduce area and enhance noise suppression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional EBG structure is used to suppress electromagnetic noise in high-frequency bands, then noise suppression capability is improved, but the structure size becomes too large for modern miniaturized electronic devices
Solution Approach 1:
The patent transitions from a planar EBG structure to a three-dimensional stacked configuration with multiple conductor planes (first, second, and third conductor planes) separated by dielectric layers. Transmission lines are arranged in different layers and connected via conductor vias, creating a vertical stacking architecture that reduces the horizontal footprint while maintaining noise suppression functionality through enhanced electromagnetic field interaction in three dimensions
Solution Approach 2:
The patent implements a nested structure where transmission lines are embedded within dielectric layers that are sandwiched between conductor planes. The first transmission line is nested between the first and second conductor planes, while the second transmission line is nested between the second and third conductor planes. This nested arrangement allows multiple functional elements to occupy overlapping spatial regions, reducing the overall structure size
2Object-affected harmful factors
If decoupling capacitors are used to suppress electromagnetic noise, then noise suppression is achieved, but parasitic inductance limits the effective frequency range to below several hundred MHz
Solution Approach 1:
The patent extracts and eliminates the parasitic inductance problem inherent in decoupling capacitor structures by replacing the capacitor-based noise suppression mechanism with an EBG structure based on transmission lines and conductor planes. This extraction of the problematic parasitic element allows the system to achieve noise suppression without the frequency limitations imposed by capacitor parasitics
Solution Approach 2:
The patent changes the fundamental operating parameters from capacitor-based low-frequency suppression to transmission line-based high-frequency suppression. By using transmission lines with specific characteristic impedances and lengths, along with conductor planes forming parallel plate structures, the system achieves effective noise suppression in the GHz frequency range where decoupling capacitors fail due to their parasitic inductance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure effectively miniaturizes the EBG structure while maintaining its noise suppression capabilities, allowing it to operate in high-frequency bands, such as those used for wireless LAN and LTE, by reducing the occupied area and optimizing the band gap frequency.
Implementation Method 1
the structure disclosed in PTL 1, 2, and 3 is a structure having EBG (Electromagnetic Band Gap) characteristics having a dispersion relation with a band gap for inhibiting propagation of electromagnetic waves at a characteristic frequency
Implementation Method 2
This structure can suppress propagation of electromagnetic noise between power supply planes
Implementation Method 3
a slit that is formed on the second conductor plane so as to partially intersect with one of the first transmission line and the second transmission line in a plan view
Data Source
AI summary
Provided is a structure including a first conductor plane (101); a second conductor plane (102); a first transmission line (104) that is formed in a layer different from the first conductor plane (101) and the second conductor plane (102); a second transmission line (105) that is disposed so as to face the second conductor plane (102) in a layer opposite to the first transmission line (104) with respect to the second conductor plane (102); a first conductor via (103) that connects one end of the first transmission line (104) with the first conductor plane (101); a second conductor via (106) that connects another end of the first transmission line (104) with one end of the second transmission line (105); and a slit (107) that is formed on the second conductor plane (102).