Compact electronic device with thermal management
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Solution Overview
Problem
Compact electronic devices, such as network-connected cameras, face challenges in dissipating heat generated by computational and communication processes without using fans, as their compact form factor restricts the application of conventional heat dissipation mechanisms like cooling fans and heat sinks.
Innovation Solution
The implementation of a passively-cooled electronic device using two separate sets of thermally conductive parts to conduct heat away from heat-sensitive assemblies within a compact housing, without the use of fans, while also mechanically supporting these assemblies to maintain functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation mechanisms like cooling fans and heat sinks are used, then heat dissipation effectiveness is improved, but device compactness deteriorates
Solution Approach 1:
The housing structure is merged with heat dissipation functionality by incorporating thermally conductive portions that directly contact heat-generating assemblies. The housing serves dual purposes: structural enclosure and heat conduction pathway, eliminating the need for separate heat sink components.
Solution Approach 2:
The housing is designed with multi-functionality, simultaneously providing mechanical support, structural enclosure, and thermal management. The thermally conductive portions of the housing act as both structural elements and heat dissipation pathways, reducing overall device volume.
2Temperature
If thermally conductive parts are added for heat dissipation, then heat management is improved, but device complexity increases
Solution Approach 1:
The housing is merged with heat dissipation components, where thermally conductive portions are integrated directly into the housing structure. This eliminates separate heat sink assemblies and reduces the number of discrete parts.
Solution Approach 2:
The housing performs multiple functions including mechanical support, enclosure, and thermal conduction. By making the housing itself thermally conductive in specific regions, the design avoids adding separate thermal management components.
3Temperature
If heat dissipation structures are implemented, then thermal performance is improved, but mechanical support capability deteriorates
Solution Approach 1:
The housing structure is combined with heat dissipation pathways, where the same structural elements that provide mechanical support also serve as thermally conductive pathways. This ensures thermal performance without compromising structural integrity.
Solution Approach 2:
The housing provides dual functionality as both mechanical support structure and thermal conduction medium. The thermally conductive portions are strategically placed to dissipate heat while maintaining the housing's load-bearing and support capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively manages heat dissipation in compact electronic devices, preventing detrimental temperature increases and ensuring the performance of heat-sensitive components, such as image sensor assemblies, without interfering with the device's intended functions.
Implementation Method 1
The first plurality of thermally conductive parts are coupled between the first electronic assembly and the housing, and are configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly
Data Source
AI summary
This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.