Compact electronic device with thermal management
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Solution Overview
Problem
Compact electronic devices, such as network-connected cameras, face challenges in dissipating heat generated by computational and communication processes without using fans, as their compact form factor restricts the application of conventional heat dissipation mechanisms like cooling fans and heat sinks.
Innovation Solution
The implementation of a passively-cooled electronic device using two separate sets of thermally conductive parts to conduct heat away from heat-sensitive assemblies within a compact housing, without the use of fans, while also mechanically supporting these assemblies and maintaining the device's intended functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation mechanisms (cooling fans, heat sinks with extended fin structures) are used, then heat dissipation performance is improved, but device compactness deteriorates
Solution Approach 1:
The housing is divided into a first portion and a second portion, with each portion independently conducting heat away from heat-sensitive assemblies. The first thermally conductive part conducts heat from first heat-sensitive assemblies through the first portion, while the second thermally conductive part conducts heat from second heat-sensitive assemblies through the second portion, enabling distributed heat management without requiring large centralized heat sinks or fans.
Solution Approach 2:
The housing portions serve dual functions: they provide structural support for the electronic assemblies and simultaneously act as heat conduction paths. The first and second portions of the housing are configured to conduct heat away from heat-sensitive assemblies, eliminating the need for separate dedicated heat sink components and maintaining compact form factor.
2Adaptability or versatility
If computational and communication capabilities are increased, then device functionality is improved, but heat generation increases
Solution Approach 1:
Heat is extracted from heat-sensitive assemblies through dedicated thermally conductive parts that conduct heat away through specific portions of the housing. This extraction approach allows high-performance computational and communication components to operate without allowing heat accumulation that would compromise their performance or nearby sensitive components.
Solution Approach 2:
The housing portions act as intermediary heat conduction paths between the heat-generating electronic assemblies and the external environment. These portions mediate the heat transfer process, conducting heat away from sensitive assemblies while maintaining the compact integrated structure of the device.
3Temperature
If heat dissipation mechanisms are added, then thermal management is improved, but device complexity increases
Solution Approach 1:
The housing structure is merged with the heat dissipation function. The first and second portions of the housing are configured to conduct heat away from heat-sensitive assemblies, combining structural support and thermal management into a single integrated component rather than requiring separate heat sink assemblies, fans, and mounting hardware.
Solution Approach 2:
The housing itself provides the heat dissipation function through its thermally conductive portions, eliminating the need for additional dedicated heat management components. The structure serves its own thermal management needs by conducting heat away from sensitive assemblies through its inherent material properties and geometric configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat dissipation in compact electronic devices, preventing detrimental temperature increases and ensuring the performance of heat-sensitive components, thereby maintaining the device's operational integrity and user experience.
Implementation Method 1
The first plurality of thermally conductive parts are coupled between the first electronic assembly and the housing, and are configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly
Data Source
AI summary
This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.