Compact Electronic Device Passive Cooling Using Segmented Housing

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Solution Overview

Problem

Compact electronic devices, such as network-connected cameras, face challenges in dissipating heat generated by computational and communication processes without using fans, as their compact form factor restricts the application of conventional heat dissipation mechanisms like cooling fans and heat sinks.

Innovation Solution

The implementation of a passively-cooled electronic device using two separate sets of thermally conductive parts within a compact housing to conduct heat away from heat-sensitive assemblies without fans, where these parts are thermally isolated and mechanically support the electronic assemblies, creating multiple heat conduction paths to efficiently dissipate heat.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional heat dissipation mechanisms like cooling fans and heat sinks with extended fin structures are used, then heat dissipation effectiveness is improved, but device size increases and compact form factor is compromised

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoiddevice size

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The housing is divided into multiple segments including a first housing portion and a second housing portion that can be separated from each other. This segmentation allows the housing itself to function as a heat dissipation structure without requiring additional bulky cooling components, as the separated portions create natural air flow paths for passive cooling.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The housing serves dual functions: it provides structural enclosure for the electronic components and simultaneously acts as a heat dissipation mechanism. The thermally conductive material in the housing conducts heat away from heat-generating components, while the segmented design enables passive air cooling, eliminating the need for separate cooling fans or large heat sinks.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Power

If computational and communication capabilities are increased to provide strong processing power, then user experience is improved, but heat generation increases and temperature control becomes more difficult

Engineering Contradiction:

Improvecomputational capabilityVSAvoidheat generation

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The device uses passive cooling mechanisms that operate automatically without requiring additional power consumption. The segmented housing design creates natural convection currents that draw heat away from high-power components, and the thermally conductive housing material continuously conducts heat away, providing self-regulating thermal management for high-performance processors.

Inventive Principle:

Principle #25Self-service

3Volume of moving object

If compact form factor is maintained, then portability is improved, but heat dissipation capability deteriorates and temperature increases

Engineering Contradiction:

Improvecompact form factorVSAvoidheat dissipation capability

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The housing material is selected with specific thermal conductivity parameters to optimize heat dissipation. The segmented design changes the geometric parameters of the housing, creating air gaps and flow paths that enhance passive cooling efficiency within the compact volume, allowing effective heat dissipation without increasing device size.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively manages heat dissipation in compact electronic devices, preventing detrimental temperature increases and maintaining performance by directing heat away from sensitive components, thus ensuring reliable operation.

Implementation Method 1

The first plurality of thermally conductive parts are coupled between the first electronic assembly and the housing, and are configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS11680677B2Compact electronic device with thermal management

Publication Date: 2023.06.20 GOOGLE LLC

AI summary

This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.