Compact FSOI Module With Conductive Shielding Against EMI
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Solution Overview
Problem
Current Free Space Optical Interconnection (FSOI) systems face limitations in high-speed signal transmission due to alignment constraints, temperature sensitivity, and vulnerability to electromagnetic interference, which restricts their use in compact and harsh environments.
Innovation Solution
A bidirectional optical connection module with encapsulated transmitter and receiver elements, protected from electromagnetic fields, using an unfocused light beam and a photodiode, integrated in a compact encapsulation box with conductive shielding and transparent windows, allowing for robust operation across a wide temperature range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser diodes are used for FSOI transmission to achieve wide bandwidth, then signal transmission capability is improved, but alignment precision requirements increase and temperature sensitivity worsens
Solution Approach 1:
The system divides the optical transmission function into separate transmitter and receiver modules that can be independently positioned and aligned. Each module contains its own optical components (LEDs or laser diodes and photodiodes), allowing modular assembly and reducing the complexity of achieving precise alignment across the entire system.
Solution Approach 2:
The patent employs wavelength division multiplexing by using different wavelengths for transmission and reception (e.g., 850nm for transmit, 1300nm for receive). This parameter change allows bidirectional communication through the same optical path without requiring precise alignment adjustments for different directions, as each wavelength can be independently optimized.
2Productivity
If laser diodes are used for FSOI transmission to achieve wide bandwidth, then signal transmission capability is improved, but temperature stability worsens
Solution Approach 1:
The system transitions from laser diodes to LEDs as the light source, changing the operational parameters to include wider spectral emission and lower temperature sensitivity. LEDs inherently exhibit better temperature stability compared to laser diodes, maintaining consistent optical output across a broader temperature range without requiring complex temperature control mechanisms.
Solution Approach 2:
The patent uses composite material structures for the optical components, including specialized photodiode materials and encapsulation materials that are designed to minimize thermal expansion and maintain optical properties across temperature variations. The encapsulation materials provide thermal isolation and protection for the sensitive semiconductor components.
3Productivity
If electrical interconnection links are used for data transfer between sub-assemblies, then data transfer capability is improved, but electromagnetic interference susceptibility increases and system size increases
Solution Approach 1:
The system replaces electrical signal transmission through physical conductors with optical signal transmission through free space. This substitution eliminates the need for shielded cables and electromagnetic shielding, as optical signals are inherently immune to electromagnetic interference. The mechanical connection between sub-assemblies is replaced by wireless optical communication.
4Reliability
If shielding covers and shielded cords are installed for electrical connections to ensure immunity, then electromagnetic interference resistance is improved, but device complexity and size increase
Solution Approach 1:
The patent replaces the entire shielding infrastructure (shielded cables, shielding covers, ground connections) with a simple optical transmission system. The complexity of designing and implementing electromagnetic shielding is eliminated in favor of a straightforward optical link between transmitter and receiver modules, significantly reducing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable, compact, and immune bidirectional high-speed signal transmission, reducing size and weight, and enhancing resistance to electromagnetic interference and temperature variations, facilitating miniaturization and robustness in electronic systems.
Implementation Method 1
a receiver element capable of receiving a modulated light wave and of restoring the modulating signal in electrical form
Implementation Method 2
The encapsulation box is configured to form a screen intended to protect, to immunize, said transmitter and receiver elements against the electromagnetic fields surrounding the module
Data Source
Figure 1~2
Figure 3~5
AI summary
The invention relates to an optical connection module (11) for creating a bidirectional optical link enabling high-speed data transmission between two elements (23, 24) of an electronic device.The module includes an emitter component (13e) capable of emitting a modulated light wave and a receiver component (13r) capable of receiving and demodulating a modulated light wave, the latter being arranged in an encapsulation housing (14) forming a protective screen of said emitter (13e) and receiver (13r) elements against electromagnetic disturbances surrounding the module (11), the upper wall (141) of which has openings (144, 145) arranged opposite the surface of the emitter element (13e) and the surface of the receiver element (13r) respectively and allowing the passage of light through the housing (14); said encapsulation housing (14) defining two separate cavities (15, 16) in which the emitter element (13e) and the receiver element (13r) are respectively housed.