Compact Heat Dissipation System With Integrated Coolant Distribution
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Solution Overview
Problem
Conventional water cooling mechanisms for servers are bulky, making it difficult to install heat dissipation systems in narrow spaces within electronic devices.
Innovation Solution
A compact heat dissipation system with a coolant distribution module that includes a module main body with a cooled fluid chamber and a power module, allowing for efficient distribution of a fluid medium through a circulating loop, reducing the overall volume and enabling installation in small spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional water cooling mechanism with external loop and manifold is used, then heat dissipation effectiveness is improved, but the volume of the heat dissipation system becomes very huge
Solution Approach 1:
The patent integrates the coolant distribution function directly into the cold plate structure by forming multiple distribution channels within the cold plate body. This merging of the distribution module and cold plate eliminates the need for separate external loops and manifolds, significantly reducing system volume while maintaining effective heat dissipation across multiple electronic components.
Solution Approach 2:
The distribution channels are nested within the cold plate structure itself. The channels are formed inside the cold plate body, allowing the cooling system to be compact and self-contained. This nesting approach enables the cooling fluid to reach multiple components through internal pathways without requiring external distribution infrastructure.
2Ease of operation
If a conventional water cooling mechanism with external loop is used, then cooling liquid can be evenly distributed to cold plates, but it is difficult to install the heat dissipation system in the narrow space within the electronic device
Solution Approach 1:
The distribution functionality is merged into the cold plate structure through internally formed channels. This integration allows uniform cooling liquid distribution to multiple components while reducing the overall system footprint to fit within narrow electronic device spaces.
Solution Approach 2:
The distribution channels are formed in the thickness direction of the cold plate. By utilizing the vertical dimension of the cold plate structure, the system achieves effective coolant distribution without expanding the horizontal footprint, enabling installation in space-constrained electronic devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively dissipates heat from electronic components within small electronic computing devices, such as personal computer hosts, by optimizing the coolant distribution and reducing the system's volume, allowing for efficient heat removal in constrained spaces.
Implementation Method 1
When the liquid with the lower temperature flows through the electronic component with the higher temperature, the liquid absorbs the heat from the electronic component to decrease the temperature of the electronic component
Implementation Method 2
Through heat exchange, the heat is released from the pipes to the surroundings or another heat dissipating mechanism
Data Source
AI summary
A heat dissipation system and a coolant distribution module for plural electronic components of an electronic computing device are provided. The heat dissipation system includes plural water-cooling heads, a heat dissipation device and the coolant distribution module. When a fluid medium flows through the heat dissipation device, the heat dissipation device exchanges heat with the fluid medium. The coolant distribution module is connected between the plural water-cooling heads and the heat dissipation device. The coolant distribution module includes a main body and a power module. The module main body includes a cooled fluid chamber. The cooled fluid chamber includes plural first outlets corresponding to the plural water-cooling heads. The power module is installed in the module main body. The power module drives the fluid medium to be outputted from the plural first outlets. Consequently, the fluid medium is transferred through a circulating loop.