Compact Heat Exchanger for Data Center Electronics
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Solution Overview
Problem
Existing cooling systems for electronic components are not compact enough and lack modularity, requiring large dimensions and separate cooling stages, which are inefficient and occupy valuable space in data centers.
Innovation Solution
A compact thermal exchange device with a sandwich-like arrangement of outer plates and an intermediate plate with bilateral fins, allowing for double fluid thermal exchange within the same casing, reducing overall dimensions and load losses while maintaining high thermal efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional cooling systems are used for electronic components, then cooling function is provided, but overall dimensions become large and space is wasted
Solution Approach 1:
The patent combines the cooling function and thermal exchange function into a single integrated device. The sandwich structure merges multiple functional elements (outer plates, intermediate plate with fins, flow channels) into one compact unit that performs both cooling and heat exchange, eliminating the need for separate cooling stages and reducing overall dimensions while maintaining cooling efficiency
Solution Approach 2:
The patent implements a nested structure where the intermediate plate with bilateral fins is positioned between two outer plates, creating flow channels that are nested within the sandwich structure. This nesting arrangement allows multiple fluid pathways to be contained within a compact volume, reducing the overall footprint while providing sufficient thermal exchange surface area
2Adaptability or versatility
If separate cooling stages are used, then thermal exchange is achieved, but device complexity increases and modularity is reduced
Solution Approach 1:
The patent segments the cooling device into modular components: outer plates, intermediate plate with fins, and spacer members. These segmented elements can be independently manufactured and assembled, allowing for easy upgrades and adaptations. The modular sandwich structure enables flexibility in configuring different numbers of intermediate plates or adjusting fin configurations without redesigning the entire cooling system
Solution Approach 2:
The intermediate plate serves multiple functions simultaneously: it provides thermal exchange surfaces on both faces, defines flow channels for cooling fluid, and acts as a structural element in the sandwich assembly. This multi-functionality reduces the need for separate dedicated components for each function, simplifying the overall device while maintaining versatility
3Temperature
If thermal exchange surface is increased, then thermal efficiency improves, but device dimensions increase
Solution Approach 1:
The patent transitions from a two-dimensional thermal exchange surface to a three-dimensional structure by adding bilateral fins that extend in the thickness direction of the intermediate plate. This dimensional change creates flow channels with significant surface area within a compact volume, allowing high thermal exchange efficiency without increasing the planar footprint of the device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves efficient thermal exchange with reduced dimensions, eliminating the need for separate cooling stages and allowing for modular upgrades, thereby optimizing space usage in data centers.
Implementation Method 1
The intermediate plate bears two thermal exchange faces with increased surface, typically by means of fins indeed arranged bilaterally on both faces of the intermediate plate
Implementation Method 2
Each one of such faces is faced on a respective outer plate. In such way, within the device a cooling fluid and a fluid to be cooled down can be fed, in order to obtain a thermal exchange stage with double fluid within the same casing
Data Source
AI summary
A thermal exchange device with reduced sizes and suitable to cool down electronic components in data center is disclosed. The device includes: a pair of outer plates integral thereto, equipped with respective inlet doors and outlet doors for a cooling fluid and for a fluid to be cooled down, respectively; and an intermediate plate, interposed between the outer plates and integral thereto, which intermediate plate bears respective thermal exchange surfaces faced to the outer plates and equipped with fins suitable to increase the area of thermal exchange with the fluids, wherein the whole configuration is so that between each outer plate and the respective exchange surface a passage compartment for the respective fluid remain defined, which thermal exchange device is made integral, at an outer plate, with the casing of the electronic component to be cooled down.