Compact High Speed Connector 25 Gbps Wafer Alignment
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Solution Overview
Problem
Existing OCULINK connectors have a performance disadvantage compared to QSFP style connectors, supporting only 16 Gbps data rates, whereas QSFP connectors support 25 Gbps, despite being smaller in size.
Innovation Solution
A plug connector assembly with a shell that wraps around a housing, featuring a first and second wafer with pegs that define a spatial relationship and are indirectly supported by a shim, allowing for 25 Gbps data rate capability by ensuring precise terminal alignment and contact force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If OCULINK connector design is used, then compact size is achieved, but data rate performance deteriorates to 16 Gbps compared to QSFP's 25 Gbps
Solution Approach 1:
The patent modifies the mechanical parameters of the connector, specifically the pitch between terminals (0.5mm pitch) and the spatial relationship between wafers, to enable higher data rates while maintaining compact dimensions. The precise positioning of terminals and wafers allows for improved signal integrity at 25 Gbps despite the smaller form factor.
2Speed
If higher data rate capability is implemented, then performance improves to 25 Gbps, but manufacturing precision requirements worsen due to tighter terminal spacing
Solution Approach 1:
The connector is divided into two separate wafers (first wafer and second wafer) that can be manufactured and positioned independently. This segmentation allows for precise control of terminal alignment through the peg mechanism, facilitating high-speed performance while managing manufacturing complexity.
Solution Approach 2:
A shim is introduced as an intermediary element between the wafers and the circuit board, providing indirect support and enabling precise spatial positioning. The pegs extending through the circuit board act as intermediaries to define the exact distance and orientation between wafers, ensuring proper terminal alignment for 25 Gbps operation.
3Manufacturing precision
If two-wafer structure with pegs is used, then spatial precision is improved, but device complexity worsens
Solution Approach 1:
The first wafer and second wafer are merged into a single assembly unit that functions as an integrated connector component. This merging simplifies the overall device structure by treating the dual-wafer configuration as a unified element, reducing the number of separate components while maintaining precise positioning through the peg-shim mechanism.
Data Source
AI summary
A connector system includes a plug assembly that has a front connector mounted to a circuit board. The connecter has two wafers that each support a row of terminals and uses shims and pegs to precisely control the spatial relationship of the two wafers to the circuit board. The wafers need not be directly contacting the circuit board and the terminals can have tails that can be positioned slightly above the circuit board and connector to pads on the circuit board via solder connections. The connector system is optimized so as to enable support of 25 Gbps data rates.