Compact Hinge Connector for High-Density Signal Transmission
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Solution Overview
Problem
Existing interfaces between system-in-package (SIP) devices, such as flexible printed circuit boards (FPCBs) and micro-coaxial cable (MCX) bundles, fail to meet system fit and hinge architecture requirements for high signal density and small form factor architectures, particularly in electronic devices with hinges.
Innovation Solution
The use of hot bars and dual row connectors, along with conductive material-filled stretchable adhesive films, to create a compact interface that electro-mechanically couples wires and shields against electromagnetic interference (EMI), allowing for high-density signal transmission while reducing the XY footprint and enhancing signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If FPCB is used for interface between SIPs, then flexibility and signal transmission are improved, but the form factor size increases and it cannot meet hinge architecture requirements
Solution Approach 1:
The patent transitions from planar FPCB connections to a three-dimensional stacked connector architecture. Multiple connector rows are stacked vertically with corresponding signal traces routed through different layers, enabling high-density signal transmission without increasing the horizontal footprint. This dimensional transition allows the interface to meet compact hinge architecture requirements while maintaining signal transmission capability.
2Quantity of substance
If MCX bundles are used to increase signal density, then higher signal density is achieved, but the termination size increases and does not meet system fit requirements
Solution Approach 1:
The patent implements a nested connector architecture where multiple connector rows are stacked and interleaved. The connectors are arranged such that signal traces from different rows are vertically stacked and electrically connected through via holes in the substrate. This nesting approach consolidates multiple signal paths into a compact termination area, achieving high signal density without increasing the overall termination footprint.
Solution Approach 2:
The solution moves signal routing from a two-dimensional planar layout to a three-dimensional stacked configuration. Multiple signal layers are routed vertically through the substrate with connectors positioned at different heights, allowing dense signal packing while maintaining a small termination footprint that meets system fit requirements.
3Area of stationary object
If compact connector design is used to reduce XY footprint, then space is saved, but EMI shielding becomes more challenging
Solution Approach 1:
The patent integrates EMI shielding functionality directly into the connector structure by combining signal traces with ground traces in a coupled arrangement. Ground shields are positioned adjacent to signal traces within the same connector layers, providing EMI protection without requiring separate shielding components that would increase the footprint. This merged design maintains compact dimensions while effectively blocking electromagnetic interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient high-speed signal transmission through hinges in electronic devices, meeting system fit and architecture requirements while minimizing EMI interference and improving reworkability and repairability.
Implementation Method 1
electro-mechanically couples wires
Implementation Method 2
conductive material-filled stretchable adhesive films
Implementation Method 3
shields against electromagnetic interference (EMI)
Data Source
AI summary
Electronic devices and methods include a first electronic device that includes a printed circuit board and a quad plug connector coupled to a first surface of a printed circuit board. A first set of wires is coupled to a second surface of the printed circuit board, and the first set of wires are parallel to each other and are located on a first plane. A second set of wires is coupled to the second surface of the printed circuit board. The second set of wires are parallel to each other and are located on a second plane. The first and second planes are each parallel to each other and to the second surface of the printed circuit board. Moreover, the first set of wires is vertically above the second set of wires.