Compact Lens Turret Assembly Alignment Features
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Solution Overview
Problem
Existing opto-electronic device assemblies, particularly in compact devices like cellular telephones and PDAs, face challenges due to the large size of turrets required for precise optical element positioning and the susceptibility of bare image-sensing chips to mechanical and chemical damage, leading to high defect rates and increased costs.
Innovation Solution
A compact opto-electronic assembly module with a sensor unit and optical unit, where the sensor unit has alignment features on its cover and the optical unit has engagement features, allowing precise positioning without the need for stringent assembly conditions, and the module can be handled as a single piece for mounting, minimizing turret size and reducing particulate contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a large turret is used to mount optical elements, then precise positioning of optical elements is achieved, but the overall device size increases
Solution Approach 1:
The patent transitions from a traditional planar turret mounting structure to a three-dimensional stacked configuration where the optical element is positioned vertically above the image sensor chip. This vertical stacking allows precise optical alignment to be achieved through vertical positioning rather than requiring a large horizontal turret area, effectively resolving the contradiction between positioning precision and device area.
2Manufacturing precision
If a bare image-sensing chip is mounted directly to the turret, then good positioning precision is achieved, but the chip becomes susceptible to mechanical damage and chemical attack
Solution Approach 1:
The patent introduces an intermediate substrate structure that serves as a mediator between the image sensor chip and the optical element mounting. This substrate provides both mechanical support and protection for the chip while enabling precise positioning through alignment features, thus resolving the contradiction between positioning precision and chip protection.
3Reliability
If stringent assembly conditions are imposed to minimize particulate contamination, then defect rates are reduced, but manufacturing complexity and cost increase
Solution Approach 1:
The patent incorporates alignment features directly into the substrate structure before the assembly process. These pre-formed alignment features (such as protrusions and recesses) ensure proper positioning of the chip and optical element without requiring complex real-time alignment procedures or stringent assembly conditions, thus reducing both defect rates and manufacturing complexity.
Data Source
AI summary
An electronic camera module incorporates a sensor unit (20) having a semiconductor chip (22) such as a CCD imager and a cover (34) overlying the front surface of the chip. An optical unit (50) includes one or more optical elements such as lenses (58). The optical unit has engagement features (64) which abut alignment features on the sensor unit as, for example, portions (44) of the cover outer surface (38), so as to maintain a precise relationship between the optical unit and sensor unit.