Compact Power Module Layout for Low Inductance and Creepage
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Solution Overview
Problem
High power applications require compact, high voltage, high current, and low inductance power modules that can accommodate various power devices and circuit topologies, but existing solutions struggle with scalability and modularity while maintaining performance and safety standards.
Innovation Solution
A novel power module design featuring a size- and cost-optimized power substrate with a modular layout that can scale to accommodate different device sizes and configurations, incorporating a thermal pad for heat management and innovative terminal arrangements for efficient electrical connections and creepage distance optimization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a compact power module design is implemented, then the footprint is reduced, but the inductance and voltage overshoot increase
Solution Approach 1:
The patent transitions from planar terminal arrangements to three-dimensional vertical stacking, allowing input and output terminals to be positioned at different heights and locations in space. This dimensional change enables compact footprint while maintaining optimized current paths that reduce inductance and voltage overshoot.
Solution Approach 2:
The patent employs dynamic terminal routing that adapts to different circuit configurations and power levels. The terminal arrangements can be optimized for specific applications, allowing the module to dynamically adjust its electrical characteristics while maintaining compact physical dimensions.
2Adaptability or versatility
If modular layout is used to accommodate different device sizes, then the adaptability increases, but the device complexity increases
Solution Approach 1:
The patent implements universal terminal blocks and standardized substrate interfaces that can accommodate multiple device configurations and circuit topologies. The same modular framework supports different power levels, device types, and connection patterns, reducing the need for multiple specialized designs while maintaining adaptability.
Solution Approach 2:
The patent divides the power module into standardized, interchangeable segments including terminal blocks, substrate sections, and device modules. This segmentation allows flexible reconfiguration for different applications while using the same basic building blocks, thereby reducing overall complexity through standardization.
3Temperature
If thermal pad is exposed for heat management, then the thermal performance improves, but the manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates the thermal pad positioning and alignment into the housing molding process itself, establishing precise thermal pad locations before final assembly. This preliminary action ensures accurate thermal management interface alignment while simplifying subsequent manufacturing steps and reducing precision requirements for later operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves scalable and modular power modules with reduced inductance and voltage overshoot, supporting high current and voltage operations while minimizing creepage distances, thus enhancing performance and safety while maintaining a compact footprint.
Implementation Method 1
The substrate has a backside with a thermal pad
Data Source
AI summary
A power module is provided with a substrate, power devices, and a housing. The power devices are mounted on device pads of the substrate and arranged to provide a power circuit having a first input, a second input, and at least one output. First and second power terminals provide first and second inputs for the power circuit. At least one output power terminal provides at least one output. The housing encompasses the substrate, the power devices, and portions of the first and second input power terminals as well as the at least one output power terminal. The first and second input power terminals extend out of a first side of the housing, and the at least one output power terminal extends out of a second side of the housing, the first side being opposite the second side.