Compact Peltier Heat Pump Assembly with Single-Fan Air Separation
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Solution Overview
Problem
Conventional Peltier-based heat pumps are bulky and require large spaces due to the need for separate fans to handle warm and cold air, limiting their application in compact environments such as economy class seats and small electronic cooling systems.
Innovation Solution
A compact heat pump assembly with a single air inlet and separate heat sinks for warm and cold air channels, utilizing a plurality of Peltier devices mounted on a base plate with harness cables, and a compact fan to direct air through the assembly, allowing efficient separation and distribution of air for both heating and cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional Peltier-based heat pumps use separate fans for warm and cold air, then heating and cooling functionality is achieved, but device size and space requirements increase
Solution Approach 1:
The patent merges the functions of separate warm air and cold air fans into a single fan that handles both air streams. The fan is positioned to draw ambient air through the Peltier device and distribute both heated and cooled air through shared ducting, eliminating the need for duplicate fan components and reducing overall device volume.
Solution Approach 2:
The single fan serves multiple functions: it draws in ambient air, pushes air through the Peltier devices for both heating and cooling operations, and distributes the conditioned air through the ducting system. This multi-functional approach replaces what would traditionally require separate dedicated fans for each air stream.
2Reliability
If Peltier devices are arranged with separate air handling for warm and cold sides, then thermal efficiency is improved, but device complexity and space increase
Solution Approach 1:
The patent combines the air handling pathways by using a single fan and shared ducting system for both warm and cold air distribution. The ducting is designed to separate air streams after they leave the Peltier devices, but the intake and propulsion functions are merged into a single fan unit, reducing structural complexity.
Solution Approach 2:
The air handling system is segmented into distinct zones: a common intake area, separate channels through the Peltier devices for heating and cooling, and shared distribution ducting. This segmentation allows efficient thermal processing while using consolidated infrastructure for air movement.
3Volume of moving object
If compact heat pump design is implemented, then space requirements are reduced, but air flow management becomes more challenging
Solution Approach 1:
The patent utilizes three-dimensional ducting design where warm and cold air streams are routed through different spatial pathways within a compact envelope. The ducting system is arranged in multiple dimensions to separate air flows after they diverge from the Peltier devices, allowing efficient air management in a reduced footprint.
Solution Approach 2:
By combining the intake and propulsion functions into a single fan and using shared ducting for air distribution, the system simplifies air flow management despite the compact size. The unified air handling approach reduces the number of moving parts and control points needed, making the system easier to operate within constrained spaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and compact heating and cooling in a variety of applications by separating and managing warm and cold air effectively within a small space, using a single fan and optimizing the flow for enhanced performance.
Implementation Method 1
Peltier devices use an array of alternating n- and p-type semiconductors having complementary Peltier coefficients. A voltage is applied across the array and the flow of current through the semiconductors causes a temperature difference across the device.
Implementation Method 2
a plurality of first heat sinks arranged in thermal contact with a first, hot, side of the Peltier devices; a plurality of second heat sinks arranged in thermal contact with a second, cold, side of the Peltier devices
Implementation Method 3
each of the first heat sinks defines a respective first channel through which inlet air warmed by the hot side of the Peltier devices flows; and each of the second heat sinks defines a respective second channel through which inlet air cooled by the cold side of the Peltier devices flows
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
A heat pump assembly comprising: a plurality of Peltier devices (8) mounted to receive air from a common air inlet (1); means (10) for causing a current to flow through the Peltier devices; a plurality of first heat sinks (6) arranged in thermal contact with a first, hot, side of the Peltier devices; a plurality of second heat sinks (7) arranged in thermal contact with a second, cold, side of the Peltier devices; wherein each of the first heat sinks defines a respective first channel through which inlet air warmed by the hot side of the Peltier devices flows; and each of the second heat sinks defines a respective second channel through which inlet air cooled by the cold side of the Peltier devices flows.