Compact Peltier Sensing Device With Partitioned Oscillator Circuit
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing sensing devices, such as Thermoelectric Quartz Crystal Microbalances (TQCM), face challenges in size reduction due to their complex structure and increased dimensions from incorporating Peltier elements and oscillator circuits.
Innovation Solution
A compact sensing device design that integrates a piezoelectric resonator with a Peltier element unit and circuit board, utilizing a partition plate to separate the oscillator circuit, and a surface-mounted connector for external connection, reducing the device's size and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a Peltier element unit and oscillator circuit are integrated into the sensing device, then temperature control and frequency sensing capabilities are achieved, but device complexity and size increase
Solution Approach 1:
The patent combines the Peltier element unit, oscillator circuit, connector, and sensing components into a single integrated sensing device housing. The circuit board integrates both the oscillator circuit and surface-mounted connector, while the Peltier element unit is directly coupled to the piezoelectric resonator substrate, creating a compact unified structure that reduces overall device complexity despite incorporating multiple functional elements.
Solution Approach 2:
The patent employs a nested arrangement where the circuit board with oscillator circuit and connector is housed within the base body, the Peltier element unit is positioned between the base body and sensor substrate, and the piezoelectric resonator is mounted on the sensor substrate. This layered nesting allows multiple components to occupy different spatial levels, reducing the device's external dimensions while maintaining all necessary functions.
2Adaptability or versatility
If multiple components are integrated into the sensing device, then functional capabilities are enhanced, but device volume increases
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration. The Peltier element unit is positioned vertically between the base body and sensor substrate, the circuit board is mounted on the inner surface of the base body, and the piezoelectric resonator is mounted on the outer surface of the sensor substrate. This vertical stacking in the Z-dimension allows multiple components to coexist in a compact footprint, significantly reducing the device's horizontal volume while maintaining enhanced functional capabilities.
3Object-affected harmful factors
If a partition plate is used to separate the oscillator circuit, then thermal interference is reduced, but device complexity increases
Solution Approach 1:
The patent divides the internal space of the base body into two separate regions using a partition plate: a first recessed portion housing the Peltier element unit and a second recessed portion housing the oscillator circuit. This segmentation physically isolates the heat-generating Peltier element from the temperature-sensitive oscillator circuit, reducing thermal interference. The partition plate is a simple structural element that achieves thermal separation without significantly increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves size reduction, cost savings, and expanded application range by optimizing component placement and eliminating unnecessary components, while maintaining effective temperature control and frequency sensing capabilities.
Implementation Method 1
The Peltier element unit includes a temperature control surface for changing the temperature of the piezoelectric resonator
Implementation Method 2
The sensor substrate holds the piezoelectric resonator... oscillating the piezoelectric resonator... variation in an oscillation frequency of the piezoelectric resonator
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A sensing device includes a sensor substrate, a Peltier element unit, a circuit board, a base body, a cover body, and a base cover. The Peltier element unit in contact with the sensor substrate. The base body includes a first recessed portion for housing a region of the Peltier element unit at a side of the heat dissipation surface, a second recessed portion for housing the circuit board, and a partition plate interposed between the first recessed portion and the second recessed portion. The cover body houses the base body in a region where the first recessed portion is formed, the Peltier element unit projecting outside the first recessed portion, and the sensor substrate, the cover body having an opening formed at a position corresponding to a region where the piezoelectric resonator is disposed for adsorption of the substance to be sensed.