Compact PIFA Antenna With Folded Ground
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Solution Overview
Problem
The challenge in wireless power transmission is the integration of compact planar inverted-F antennas (PIFAs) into receivers for smaller handheld electronic devices, requiring reduced antenna size while maintaining performance and mechanical robustness, especially in complex wireless function environments.
Innovation Solution
The design of PIFA configurations with slots on the antenna and ground elements on a printed circuit board (PCB), including a folded ground structure, reduces the system area while maintaining omnidirectional radiation patterns and improving impedance bandwidth and radiation efficiency, allowing for compact integration into electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the antenna size is reduced to fit smaller handheld devices, then the device compactness is improved, but the radiation efficiency and impedance bandwidth deteriorate
Solution Approach 1:
The patent employs a three-dimensional folded ground structure instead of a conventional planar ground, utilizing vertical and lateral folding to achieve compactness in multiple dimensions while preserving the electrical performance and radiation efficiency of the antenna
Solution Approach 2:
The ground structure is folded back and nested within the antenna assembly footprint, with the ground element folding underneath itself to create a compact configuration that maintains sufficient ground area for proper antenna operation without increasing the overall device volume
2Volume of moving object
If the antenna size is reduced to fit smaller handheld devices, then the device compactness is improved, but the impedance bandwidth deteriorates
Solution Approach 1:
The folded ground structure introduces additional electrical path lengths in three dimensions, effectively increasing the electrical bandwidth while maintaining a compact physical footprint, allowing the antenna to operate across a wider frequency range despite reduced size
Solution Approach 2:
The patent modifies the electrical characteristics of the ground structure through folding, which changes the inductance and capacitance parameters to broaden the impedance bandwidth while keeping the physical dimensions compact
3Area of stationary object
If slots are added to reduce antenna area, then the area is reduced, but the structural complexity increases
Solution Approach 1:
The ground structure is segmented into folded sections rather than using slots, dividing the ground plane into manageable segments that are easier to manufacture while achieving the same area reduction effect through three-dimensional configuration
4Area of stationary object
If the ground area is reduced, then the system area is reduced, but the radiation efficiency deteriorates
Solution Approach 1:
The ground structure transitions from a two-dimensional plane to a three-dimensional folded configuration, maintaining sufficient electrical ground area for efficient radiation while reducing the projected footprint area that occupies device space
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These configurations achieve significant reductions in size and volume while maintaining suitable performance for wireless power transmission, enabling flexible placement and efficient energy transfer.
Implementation Method 1
maintaining an omnidirectional radiation pattern
Data Source
AI summary
Various planar inverted-F antenna configurations may include an antenna element formed on the top of a PCB and a ground element formed on the bottom of the PCB. Two or more slots may be included in the antenna element for reducing the antenna area while maintaining a suitable impedance bandwidth. A slot may be included in the ground element for reducing the ground area while increasing radiation efficiency. A folded ground may be formed on the top of the PCB for reducing system area while maintaining suitable performance. By moving the folded ground closer to the antenna element and increasing the PCB thickness, significant reductions in system area may be achieved, while maintaining or improving performance in terms of radiation pattern, radiation efficiency and impedance bandwidth.