Compact Power Converter Integration for High Density
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Solution Overview
Problem
Current power converters, such as inverters and rectifiers, are large and heavy, limiting their power density and making them unsuitable for applications requiring high power density, such as electric vehicles and industrial machinery, where smaller and lighter solutions are needed to meet increasing energy demands.
Innovation Solution
The development of compact power converters, including compact inverters and rectifiers, which utilize packaged switch modules with insulated-gate bipolar transistors (IGBTs) and gate drivers, and switch controllers to achieve high power density by optimizing the design and integration of switch modules with die substrates and die clips for improved thermal and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional power converter designs are used, then device functionality is achieved, but device size and weight are large, limiting power density
Solution Approach 1:
The patent combines multiple previously separate components into integrated modules. Specifically, the rectifier and inverter are merged into a single bidirectional power converter unit, and further integration occurs by incorporating gate drivers, controllers, and passive components directly within the same package as the power switches. This merging eliminates the need for separate mounting of these components and reduces overall device volume while maintaining power density.
Solution Approach 2:
The patent implements a nested structure where smaller components are placed inside or within the structural elements of larger components. Gate drivers are integrated within the power switch modules, controllers are embedded within the converter housing, and passive components are positioned within the same package. This nesting arrangement maximizes space utilization and achieves high power density by eliminating wasted space between components.
2Power
If conventional power converter designs are used, then device functionality is achieved, but device weight is high, making them unsuitable for applications requiring high power density
Solution Approach 1:
The patent combines multiple previously separate components into integrated modules. Specifically, the rectifier and inverter are merged into a single bidirectional power converter unit, and further integration occurs by incorporating gate drivers, controllers, and passive components directly within the same package as the power switches. This merging eliminates the need for separate mounting of these components and reduces overall device volume while maintaining power density.
Solution Approach 2:
The patent employs composite construction methods, particularly in the form of printed circuit board assemblies that integrate multiple functional layers. The use of multi-layer PCBs with embedded passive components and the combination of different materials (metal substrates, ceramic insulators, plastic encapsulants) creates a compact, lightweight structure that achieves high power density without excessive weight.
3Power
If power converters are reduced in size for high power density, then power density increases, but thermal management becomes more challenging
Solution Approach 1:
The patent combines multiple previously separate components into integrated modules. Specifically, the rectifier and inverter are merged into a single bidirectional power converter unit, and further integration occurs by incorporating gate drivers, controllers, and passive components directly within the same package as the power switches. This merging eliminates the need for separate mounting of these components and reduces overall device volume while maintaining power density.
Solution Approach 2:
The patent introduces thermal management intermediaries such as heat sinks, thermal vias, and thermally conductive materials positioned between heat-generating components and the external environment. These intermediary elements facilitate efficient heat transfer from the densely packed power components to cooling surfaces, enabling thermal management in compact high-power-density configurations.
Data Source
AI summary
A device that includes a printed circuit board (PCB), a metal conductor, and a transistor. The metal conductor includes first and second oppositely facing surfaces. The transistor includes first and second terminals between which current is transmitted when the transistor is activated, and a gate terminal for controlling the transistor. The first terminal is sintered to the first surface, and the gate is electrically connected to a trace on the PCB.