Compact Solid State Relay Packaging for Heat Dissipation
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Solution Overview
Problem
The use of solid state relays in small form factor devices is limited due to heat dissipation issues, which restricts their application in space-constrained environments like data centers and power distribution systems, where traditional mechanical relays dominate due to faster transfer times but are less efficient in heat waste.
Innovation Solution
The implementation of improved packaging methods for solid state relays, including multiple heat sink elements and a sub-miniature fan for efficient heat dissipation, allowing for the use of solid state relays in place of traditional mechanical relays in compact designs, particularly in data center applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If solid state relays are used in small form factor packages, then heat dissipation becomes a significant issue that limits their application in space-constrained environments
Solution Approach 1:
The relay package is segmented into distinct functional zones: a first portion for mounting the solid state relay and a second portion for mounting heat sink elements. This segmentation allows heat dissipation components to be spatially separated from the relay while maintaining thermal coupling, enabling effective heat management in compact form factors.
Solution Approach 2:
Heat sink elements are mounted within the relay housing structure, nesting the thermal management system inside the existing package boundaries. This nested arrangement maximizes heat dissipation surface area without increasing the overall package volume, resolving the contradiction between compact size and heat dissipation capability.
2Speed
If traditional mechanical relays are used, then transfer time is faster, but heat waste is higher compared to solid state relays
Solution Approach 1:
The invention replaces mechanical relay systems with solid state relays that use semiconductor switches instead of mechanical contacts. This substitution eliminates mechanical wear and reduces heat waste while maintaining fast transfer times characteristic of solid state technology, directly addressing the energy loss issue while preserving speed advantages.
3Loss of time
If solid state relays are used in mission critical equipment, then power outage time is reduced, but heat management complexity increases
Solution Approach 1:
The heat sink elements are integrated with the relay housing structure, merging the thermal management function with the mechanical enclosure. This consolidation reduces device complexity by eliminating separate heat management components while maintaining effective heat dissipation, thereby supporting the use of solid state relays in mission critical applications where rapid response is essential.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of solid state relays in small form factor devices by effectively managing heat waste, offering faster actuation times and improved current control, while maintaining compatibility with existing designs and reducing power outage times in mission-critical equipment.
Implementation Method 1
Multiple heat sink elements are provided within the housing for dissipating heat generated by the relay in operation
Implementation Method 2
a fan position for producing air flow across the heat sink elements
Data Source
AI summary
A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.