Compact RGB LED Module with Integrated Sensing and Light Shielding
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Solution Overview
Problem
Existing light-emitting modules lack compact design and integrated sensing functionality, limiting their ability to efficiently interact with the external environment and display information effectively.
Innovation Solution
A light-emitting module with a circuit substrate featuring conductive channels and pads, arranged in a matrix with red, green, and blue LED chips, encapsulated by a translucent component, and incorporating an electric component for sensing and interaction, along with a light-shielding structure for improved contrast.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple LED chips and electric components are arranged on a circuit substrate, then the display functionality is achieved, but the module size increases and compactness is reduced
Solution Approach 1:
The patent combines multiple LED chips (red, green, blue) and electric components onto a single circuit substrate, integrating display functionality into one compact module. This merging approach achieves full-color display capability while maintaining a small form factor suitable for mobile device applications.
Solution Approach 2:
The circuit substrate serves multiple functions simultaneously: it provides mechanical support for LED chips, electrical connections through conductive channels and pads, and houses additional electric components for enhanced functionality. This multi-functionality reduces the need for separate components and contributes to compact design.
2Manufacturing precision
If LED chips are densely arranged to improve display resolution, then information display capability is enhanced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent implements localized heat management by providing individual heat dissipation paths for each LED chip through the circuit substrate structure. The substrate design includes specific thermal conduction channels that direct heat away from each light-emitting group, allowing high-density arrangement while maintaining effective heat dissipation at each local location.
3Reliability
If a translucent encapsulating component is added to protect LED chips, then reliability is improved, but the structure becomes more complex
Solution Approach 1:
The encapsulating component serves multiple functions simultaneously: it protects the LED chips from environmental damage, provides structural support for the entire light-emitting module, and facilitates heat dissipation through its thermally conductive material. This multi-functionality reduces the need for separate protective structures, simplifying the overall design while maintaining high reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a compact, efficient light-emitting module that enhances display capabilities and interaction with the external world through integrated sensing, while improving heat dissipation and contrast.
Implementation Method 1
the first surface includes a plurality of light-emitting groups arranged in a matrix. Each of the light-emitting groups includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip
Implementation Method 2
LEDs are able to emit monochromatic light so that they can be assembled as a full color pixel unit in the display apparatus by combining red, green, and blue LED chips which emit three primary colors
Implementation Method 3
A translucent encapsulating component covers the plurality of light-emitting groups and the electric component
Data Source
AI summary
The present disclosure provides a light-emitting module and a display apparatus thereof. The light-emitting module includes a circuit substrate which includes a first surface and a second surface opposite to the first surface. The first surface includes a plurality of conductive channels, and the second surface includes a plurality of conductive pads. A plurality of light-emitting groups is arranged in a matrix on the first surface. Each of the light-emitting groups includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. An electric component is disposed on the first surface and located in the light-emitting groups matrix. A translucent encapsulating component covers the plurality of light-emitting groups and the electric component. The light-emitting groups matrix comprises m columns and n rows.