Substrate Processing Chamber With Compact Sealed Pressure Space
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Solution Overview
Problem
Existing substrate processing apparatuses face limitations in achieving fast pressure change rates across a wide pressure range, maintaining process temperature, and ensuring durability of gate valves due to large processing volumes and heat loss, particularly when processing high-pressure substrates.
Innovation Solution
The apparatus includes a process chamber with a minimized processing space defined by a filling member and a vertically movable inner lid, along with a substrate support system that minimizes volume and maintains temperature, enabling rapid pressure changes and secure sealing without damaging gate valves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the processing space volume is reduced to achieve fast pressure change rate, then pressure change rate is improved, but heat loss to surrounding process chamber increases and process temperature maintenance becomes difficult
Solution Approach 1:
The processing chamber is segmented into an inner processing space and an outer process chamber, allowing the inner space to be minimized for fast pressure changes while the outer chamber provides thermal insulation. The inner lid part creates a sealed inner processing space that is spatially separated from the surrounding process chamber, enabling independent volume optimization.
Solution Approach 2:
The inner processing space is nested within the outer process chamber, with the inner lid part defining a compact processing volume inside the larger chamber. This nested structure allows the inner space to be minimized for rapid pressure changes while the outer chamber provides thermal mass and insulation to reduce heat loss.
2Temperature
If the processing space volume is large, then heat loss is reduced and temperature maintenance is easier, but pressure change rate deteriorates
Solution Approach 1:
The processing chamber is segmented into an inner processing space and an outer process chamber, allowing the inner space to be minimized for fast pressure changes while the outer chamber provides thermal insulation. The inner lid part creates a sealed inner processing space that is spatially separated from the surrounding process chamber, enabling independent volume optimization.
3Adaptability or versatility
If high pressure processing is performed with conventional gate valve, then substrate processing capability is improved, but gate valve durability deteriorates due to pressure inability to withstand
Solution Approach 1:
The gate valve is extracted from the inner processing space and positioned in the outer process chamber, separating the sealing function from the high-pressure processing environment. The inner lid part provides sealing for the inner processing space without requiring the gate valve to withstand high pressures, allowing the valve to be placed in a lower-pressure zone.
4Productivity
If repeatedly wide pressure range is performed within short time, then productivity is improved, but heat loss increases and heater efficiency deteriorates
Solution Approach 1:
The processing chamber is segmented into an inner processing space and an outer process chamber, allowing the inner space to be minimized for fast pressure changes while the outer chamber provides thermal insulation. This segmentation enables rapid pressure cycling in the inner space without significant heat loss to the outer chamber.
Solution Approach 2:
The outer process chamber, which could be seen as additional volume slowing pressure changes, is converted into a thermal insulation layer that reduces heat loss during rapid pressure cycling. The outer chamber acts as a thermal buffer that maintains process temperature during frequent pressure transitions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for rapid pressure changes from 0.01 Torrs to 5 Bars at a rate of 1 Bar/s, maintains process temperature efficiently, and prevents heat loss, while ensuring durability and minimizing gas leakage.
Implementation Method 1
a filling member 700 installed between the substrate support 200 and an inner surface of the installation groove 130 to occupy at least a portion of a space between the substrate support 200 and the inner surface of the installation groove 130
Implementation Method 2
an inner lid part 300 which is installed to be vertically movable in the inner space S1 and of which a portion is in close contact with the bottom surface 120 adjacent to the installation groove 130 through descending to define a sealed processing space S2
Implementation Method 3
a gas supply part 400 installed to communicate with the processing space S2 and configured to supply a process gas to the processing space S2
Implementation Method 4
The solution allows for rapid pressure changes from 0.01 Torrs to 5 Bars at a rate of 1 Bar/s
Data Source
AI summary
The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus in which a substrate is processed at a high pressure and a low pressure. The substrate processing apparatus of the present invention includes: a process chamber (100) including a chamber body (110) which has an opened upper portion and in which an installation groove (130) is defined at a central side of a bottom surface (120) thereof, and a gate (111) configured to load/unload a substrate (1) is disposed at one side thereof, and a top lid (140) coupled to the upper portion of the chamber body (110) to define an inner space (S1); a substrate support (200) installed to be inserted into the installation groove (130) of the chamber body (110) and having a top surface on which the substrate (1) is seated.