Compact Image Sensor Array Layout for Thermal Noise Control
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Solution Overview
Problem
Existing digital imaging systems face challenges in achieving high sensor density while managing thermal dissipation, ensuring high-speed signal transmission, and synchronizing sensor outputs for contiguous image acquisition, particularly in high-resolution image capture applications.
Innovation Solution
A digital imaging system with an array of digital image sensors on a single printed circuit board (PCB) at tight inter-sensor spacing, featuring a first digital processing unit for signal aggregation and pre-processing, and a second unit for further processing and storage, along with thermal management mechanisms like ground planes and heat sinks, to ensure efficient thermal dissipation and synchronized processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If digital image sensors are arranged at tight inter-sensor spacing on a single PCB to achieve high sensor density, then sensor packing density is improved, but thermal dissipation becomes more difficult and thermal noise increases
Solution Approach 1:
The system divides the sensor array into multiple independently mounted digital image sensors positioned at tight spacing on a single PCB. Each sensor operates as an independent unit with its own readout circuit, allowing high density packing while maintaining individual thermal management capability for each sensor element.
Solution Approach 2:
The patent transitions from traditional single-sensor or few-sensor arrangements to a multi-sensor array configuration mounted on a single PCB substrate. This dimensional reorganization allows sensors to be positioned in a two-dimensional grid pattern at tight spacing, maximizing area utilization while enabling systematic thermal management approaches across the array.
2Measurement precision
If multiple digital image sensors are integrated on a single PCB with tight spacing, then high-resolution imaging is achieved, but thermal management complexity increases
Solution Approach 1:
The PCB substrate serves multiple functions simultaneously: it provides mechanical support for the sensor array, electrical interconnection through trace routing, and thermal management through ground planes and heat dissipation structures. This multi-functionality reduces overall system complexity despite the high density of integrated components.
Solution Approach 2:
Ground planes are introduced as intermediary elements between the sensor elements and the PCB substrate. These ground planes serve as thermal intermediaries, conducting heat away from the sensors while also providing electrical shielding and mechanical support, thereby simplifying the thermal management architecture.
3Quantity of substance
If sensors are positioned close together on a PCB, then sensor array density is improved, but signal transmission integrity becomes more difficult to maintain
Solution Approach 1:
The PCB trace routing is optimized with locally differentiated characteristics: wider trace widths and increased spacing are provided in regions where signal integrity is critical, while tighter routing is used in less sensitive areas. This local quality adjustment maintains signal transmission reliability despite the overall tight sensor spacing.
Solution Approach 2:
Impedance matching and signal conditioning circuits are pre-configured at each sensor location before signals are transmitted across the PCB. This preliminary action ensures that signals are properly conditioned at the source, reducing the impact of transmission losses and interference that occur due to tight sensor spacing.
4Device complexity
If a centralized processing unit is used to aggregate signals from all sensors, then device complexity is reduced, but processing speed and synchronization become bottlenecks
Solution Approach 1:
The processing architecture is segmented into distributed processing units, with each sensor or small group of sensors having its own processing capability. This segmentation allows parallel processing of image data from multiple sensors simultaneously, eliminating the bottleneck of centralized processing while maintaining manageable complexity through modular design.
Solution Approach 2:
The system transitions from a single-level centralized processing architecture to a multi-level hierarchical processing structure. Local processing units perform initial image processing and data reduction at the sensor level, while a central controller coordinates between units and performs final integration. This dimensional reorganization of the processing hierarchy enables parallel operation and eliminates processing bottlenecks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high sensor packing density with improved thermal management and high-speed data processing, enabling high-resolution imaging with reduced thermal noise and minimal latency, suitable for real-time applications.
Implementation Method 1
Each digital image sensor comprises an array of light sensitive pixels configured to detect incident electromagnetic radiation and convert the detected electromagnetic radiation into a digital signal
Implementation Method 2
a first digital processing unit positioned at a finite distance from the digital image sensors to mitigate heat transfer and configured to receive the digital signals from the digital image sensors, aggregate the digital signals into a set of digital image data, and pre-process the set of digital image data
Implementation Method 3
a second digital processing unit configured to receive the pre-processed digital image data from the first digital processing unit for further processing and digital storage
Implementation Method 4
The PCB comprises a plurality of electrical traces, ground planes and heat sinks
Implementation Method 5
The PCB comprises a plurality of electrical traces, ground planes and heat sinks
Data Source
AI summary
Disclosed is a digital imaging system comprising an array of more than one digital image sensor arranged on a single printed circuit board at a tight inter-sensor spacing that is less than the width of two adjacent image sensors. Each sensor comprises an array of light sensitive pixels that detect incident electromagnetic radiation and convert it into a digital signal. Further, a first digital processing unit is operatively connected to the electrical traces and is positioned at a finite distance from the digital image sensors to mitigate heat transfer. The first digital processing unit receives the digital signals from the sensors, aggregates them into a set of digital image data, and pre-processes the data. Moreover, a second digital processing unit then receives the pre-processed data for further processing and digital storage. Such an architecture offers enhanced image quality through improved thermal management and synchronized data aggregation.