Compact Sensor Module with Orthogonal Base Walls
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Solution Overview
Problem
Conventional sensor modules using molded interconnect device (MID) technology are hindered by their large size and triangular pyramid shape, which complicates miniaturization and creates dead space in electronic devices, making them unsuitable for compact designs.
Innovation Solution
A sensor module with a base member featuring pattern wiring directly formed on a molded component, including a principal surface and orthogonal side walls, where sensors are mounted on lands formed by the pattern wiring, allowing for a compact configuration that reduces height and width, enabling efficient housing in miniaturized electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional MID technology with triangular pyramid shape is used, then sensors can be mounted on multiple surfaces, but the device size becomes large and creates dead space
Solution Approach 1:
The base member is divided into multiple surfaces (first surface, second surface, third surface) that are orthogonal to each other, allowing sensors to be mounted on different faces. This segmentation enables compact arrangement of three sensors detecting orthogonal directions while maintaining a small overall footprint, eliminating the need for a triangular pyramid shape.
Solution Approach 2:
The patent transitions from a triangular pyramid configuration to a rectangular prism configuration with orthogonal surfaces. This dimensional reorganization allows sensors to be arranged on three mutually orthogonal faces (x, y, z directions) within a compact rectangular footprint, optimizing space utilization and eliminating dead space in the housing.
2Length of moving object
If sensors are mounted on orthogonal surfaces, then three-direction detection is achieved, but the height and width increase
Solution Approach 1:
The pattern wiring is pre-formed on the base member during the molding process, creating landing portions at predetermined positions on each surface. This preliminary action ensures that sensor mounting locations are precisely defined before actual sensor attachment, achieving high mounting precision without increasing overall dimensions.
Solution Approach 2:
The patent replaces complex mechanical mounting structures with pattern wiring that is directly formed on the base member. The wiring patterns create electrical and mechanical connection points (landing portions) that simplify the sensor mounting process while maintaining precise positioning, thereby reducing the need for additional structural elements that would increase size.
Data Source
AI summary
A sensor module includes a base member and a sensor, wherein the base member is a molded component on which pattern wiring is directly formed, wherein the base member includes at least a principal surface, a first side wall orthogonal to the principal surface, and a second side wall orthogonal to the principal surface and the first side wall, and wherein a larger one of a width of the first side wall and a width of the second side wall in a first direction perpendicular to the principal surface is larger than a width of the principal surface in the first direction.