Compact Test Fixture Using Segmented Routing Board and Backplane
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Solution Overview
Problem
Existing test fixtures for electronic devices are large, labor-intensive to manufacture, and require numerous customer-specific components, leading to increased manufacturing time and complexity.
Innovation Solution
A compact test fixture with standardized components, decoupling customer-specific features from generic features, utilizing a routing board, probes, and a backplane assembly to provide electrical connections for efficient signal transmission between electronic instruments and devices, minimizing the need for wires and cables.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If known test fixtures are used, then testing functionality is achieved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The test fixture is divided into separate functional modules: a backplane assembly containing standardized electronic instruments, a routing board for signal distribution, and probe assemblies for device contact. This segmentation allows each module to be manufactured and tested independently, reducing overall manufacturing complexity while maintaining complete testing functionality.
Solution Approach 2:
The backplane assembly is designed as a universal platform that can accommodate different electronic instruments and test different device types through standardized interfaces. The routing board provides generic signal distribution paths that can be configured for various testing scenarios, eliminating the need for custom-built fixtures for each device type.
2Productivity
If standardized components are used, then manufacturing time is reduced, but adaptability to specific devices may be limited
Solution Approach 1:
The routing board incorporates configurable signal paths and selectable connection options that can be dynamically adjusted through software control or physical switchers. This allows the standardized hardware platform to adapt its signal routing configuration to match the specific testing requirements of different devices, maintaining versatility without sacrificing manufacturing efficiency.
3Volume of moving object
If a compact design is implemented, then form factor is reduced, but manufacturing precision requirements increase
Solution Approach 1:
By dividing the test fixture into modular components (backplane, routing board, probe assemblies), each component can be manufactured to standard tolerances and then precisely positioned during assembly using standardized mounting interfaces. This segmentation reduces the overall manufacturing precision burden compared to building a monolithic compact fixture, while still achieving a reduced form factor through efficient spatial arrangement of modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manufacturing time and complexity by allowing for pre-manufactured standardized components, enabling faster production and easier assembly, while maintaining a small form factor suitable for various electronic devices.
Implementation Method 1
a plurality of probes arranged to provide a respective plurality of first electrical connections between the electronic junctions of the device and the routing board
Implementation Method 2
a backplane assembly electrically connected to the instrument, wherein the backplane assembly is arranged to provide a second electrical connection to the routing board such that a test signal can be transmitted between the instrument and a selected set of electronic junctions of the device
Data Source
Figure 1
Figure 2a~2b
Figure 3
AI summary
There is provided a test fixture (300) for testing of a device (100) with electronic junctions (101), the test fixture comprising: a routing board (303); at least one electronic instrument (301) for performing a test procedure of the device; a plurality of probes (302) arranged to provide a respective plurality of first electrical connections between the electronic junctions of the device and the routing board; and a backplane assembly (304) electrically connected to the instrument, wherein the backplane assembly is arranged to provide a second electrical connection to the routing board such that a test signal can be transmitted between the instrument and a selected set of electronic junctions of the device via the first and second connections.