Compact Thermal Layout With Blower Shielding for Computing Architecture
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Solution Overview
Problem
The challenge of thermal management in electronic devices with reduced footprint becomes more complex due to increased heat generation from advanced components, requiring innovative design changes for heat pipes and blowers to fit within the confined space while managing electromagnetic interference and radio frequency noise.
Innovation Solution
The internal layout includes angled blower bases, curved thermal components, and a Faraday cage to separate wireless communication components, along with a chamfered housing design to accommodate thermal components and shield against electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the footprint of electronic devices is reduced, then the device size is minimized, but thermal management becomes more complex and difficult
Solution Approach 1:
The patent implements nested thermal management by placing the heat pipe internally within the blower assembly, where the heat pipe is positioned concentrically with the blower housing. This nesting arrangement allows the thermal management system to fit within the existing air flow path without increasing the overall device footprint, while still providing effective heat dissipation from high-power components.
Solution Approach 2:
The patent transitions from planar thermal management to three-dimensional thermal management by incorporating vertical heat pipes that extend along the blower housing axis, and by stacking multiple thermal components (heat pipes, vapor chambers) in the vertical dimension. This dimensional transition allows efficient heat dissipation within a compact volume by utilizing space in all three dimensions rather than only horizontal expansion.
2Productivity
If advanced components are used to increase capability, then device performance is improved, but heat generation increases
Solution Approach 1:
The patent introduces a heat pipe as an intermediary thermal transfer device between the high-power electronic components and the blower housing. The heat pipe acts as a thermal conduit that efficiently transports heat from the components to the housing, where it can be dissipated through the air flow generated by the blower, thereby protecting the components from excessive heat while maintaining high performance.
Solution Approach 2:
The patent utilizes the blower-generated air flow as a pneumatic cooling medium that passes through and around the thermal components. The forced convection air flow created by the blower enhances heat dissipation from the heat pipes and vapor chambers, allowing advanced high-performance components to operate at elevated capabilities while maintaining safe operating temperatures through active pneumatic cooling.
3Temperature
If thermal components are added to manage heat, then heat dissipation is improved, but device volume increases
Solution Approach 1:
The patent merges the thermal management function with the existing blower housing structure by integrating heat pipes directly into the housing walls and using the housing itself as a heat dissipation surface. This merging eliminates the need for separate, additional thermal management components that would increase device volume, as the structural housing simultaneously serves as both enclosure and thermal management element.
Solution Approach 2:
The blower housing is designed to serve multiple functions simultaneously: it provides structural enclosure for the device, generates forced convection air flow for cooling, acts as a heat dissipation surface for the integrated heat pipes, and serves as a mounting structure for electronic components. This multi-functionality allows effective heat dissipation without adding dedicated thermal management volume, as each component performs multiple roles.
4Volume of moving object
If components are densely packed to reduce size, then device compactness is improved, but electromagnetic interference increases
Solution Approach 1:
The patent segments the device interior into distinct functional zones using partition walls and housing structures, separating high-frequency wireless communication components from other electronic components and thermal management elements. This spatial segmentation reduces electromagnetic interference by creating isolated zones for different functional systems while maintaining overall device compactness through efficient use of three-dimensional space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This layout effectively manages thermal and electromagnetic interference, ensuring efficient heat dissipation and noise isolation within the compact electronic device.
Implementation Method 1
A heat pipe may be thermally coupled with the integrated circuit and extended to a housing of the blower. The heat pipe may be bent at a first angle at a first end and bent at a second angle at a second end
Implementation Method 2
The blower may be positioned between a power system and a thermal component. The blower base may be angled to receive components such as a mount that carries thermal components, such as a fin stack and a heat pipe
Implementation Method 3
The internal layout includes angled blower bases, curved thermal components, and a Faraday cage to separate wireless communication components, along with a chamfered housing design to accommodate thermal components and shield against electromagnetic interference
Data Source
AI summary
An electronic device includes several thermal components designed to fit within a housing defined by housing components. The thermal components may include a thermal slug, a heat pipe, and a fin stack. The fin stack may include radial fans that allow the fin stack to align with a blower, including a fan outlet of the blower. The heat pipe may bend and curve around the blower. Additionally, the electronic device may include a power system and a circuit board stacked over the blower. Several pins may be used to align the power system and the circuit board within the housing of the electronic device.