Thermal Dissipation Module with Multidirectional Heat Conductors
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Solution Overview
Problem
Conventional heat dissipation methods in mobile devices, such as mobile phones and tablet PCs, are inadequate for efficiently managing heat generated by high-power electronic components due to size and weight constraints, leading to overheating issues.
Innovation Solution
A heat dissipation module with a compact structure that includes an evaporator, heat conducting components, and a working fluid loop, where the evaporator has a heat conducting zone to enhance thermal contact with the heat source, and the working fluid absorbs heat, transforming into vapor to dissipate it effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional heat dissipation methods (heat dissipation material or heat pipe) are used, then the device structure remains simple, but the heat dissipation efficiency is insufficient under high power electronic components
Solution Approach 1:
The evaporator is segmented into multiple heat conducting components (first heat conducting component, second heat conducting component, third heat conducting component) with different shapes and orientations. This segmentation allows each component to optimize heat conduction in specific directions, increasing overall heat dissipation efficiency while maintaining a compact structure suitable for mobile devices.
Solution Approach 2:
The patent introduces multi-dimensional heat conduction by orienting heat conducting components in different directions (first direction, second direction, third direction perpendicular to the first two). This multi-dimensional approach maximizes the thermal contact area between the evaporator and heat source without increasing the overall device footprint, thereby improving heat dissipation efficiency within space constraints.
2Area of stationary object
If the evaporator has a compact structure to fit mobile device constraints, then the device size is reduced, but the thermal contact area with the heat source is limited
Solution Approach 1:
The heat conducting components are oriented in multiple dimensions (first direction, second direction, and third direction perpendicular to both), allowing the evaporator to achieve extensive thermal contact area within a compact footprint. This multi-dimensional arrangement maximizes the interface area between the evaporator and heat source without increasing the overall device volume.
Solution Approach 2:
Different heat conducting components have different shapes and orientations tailored to local heat distribution patterns. The first heat conducting component extends in the first direction, the second in the second direction, and the third in the third direction, creating localized heat conduction pathways that optimize thermal contact area within the compact evaporator structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module increases thermal contact area and heat dissipation efficiency, providing effective heat management and improved space utilization in electronic devices.
Implementation Method 1
The working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor
Implementation Method 2
The working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor to flow out of the evaporator
Implementation Method 3
An exterior of the evaporator has a heat conducting zone thermally contacted with the heat source to absorb heat generated from the heat source
Data Source
AI summary
A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a plurality of heat conducting components, a pipe connected to the evaporator to form a loop, and a working fluid filled in the loop. An exterior of the evaporator has a heat conducting zone thermally contacted with the heat source to absorb heat generated from the heat source. The heat conducting components are disposed in the evaporator, located at an interior of the evaporator corresponding to the heat conducting zone. The heat conducting components are in pillar shape or rib shape respectively. The working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor to flow out of the evaporator. Each of the heat conducting components in rib shape is oriented in a flow direction of the working fluid.