Compact Transceiver Integrating Gain Module and Signal Processor
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Solution Overview
Problem
Existing radio signal transceivers are limited by their power consumption and size, which restricts their practical applications due to the need for multiple components that perform various functions such as RF up and down conversion, clocking, and signal processing.
Innovation Solution
A compact transceiver design that includes a non-hermetic, parylene-coated circuit board with a RF pass-through path and a transceiver path, utilizing a gain module and signal processor to amplify and process signals within high and low frequency bands, respectively, while maintaining a compact form factor and reducing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components are used to perform various functions (RF up/down conversion, clocking, signal processing), then functional versatility is improved, but device size and power consumption increase
Solution Approach 1:
The patent integrates multiple discrete components (RF upconverter, downconverter, signal processor, clock generator) into a single integrated circuit chip. This merging of functions into one compact device reduces overall device size while maintaining full functional versatility across both frequency bands.
Solution Approach 2:
The integrated circuit is designed to perform multiple functions simultaneously - RF upconversion for high band, downconversion for low band, signal processing, and clocking - all within a single universal device that serves multiple communication purposes without requiring separate dedicated components.
2Adaptability or versatility
If multiple components are used to perform various functions (RF up/down conversion, clocking, signal processing), then functional versatility is improved, but power consumption increases
Solution Approach 1:
By combining multiple power-consuming components into a single integrated circuit, the patent reduces total power consumption through shared power management resources and eliminated redundant circuitry interfaces, while still providing full functional versatility for RF conversion and signal processing.
3Volume of stationary object
If a compact form factor is achieved, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent employs a nested structure where the integrated circuit chip (containing multiple functional components) is mounted on a circuit board, which is then housed within an enclosure. This nested arrangement achieves compact form factor while maintaining manufacturability through standardized assembly processes at each nesting level.
Data Source
AI summary
A transceiver unit includes an enclosure, a first input port, a second input port, a first output port, and a second output port. A radio frequency (RF) pass-through path is within the enclosure between the first input port and the first output port and includes a gain module. The RF pass-through path is configured to receive a first RF signal at the first input port and to transmit a second RF signal at the first output port. The gain module is configured to amplify the first RF signal to produce the second RF signal. The transceiver unit further includes a transceiver path within the enclosure between the second input port and the second output port, the transceiver path including a signal processor.