Compact Tunable Laser with Hermetic Seal and Beam Splitter
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Solution Overview
Problem
There is a constant industry challenge to reduce the size of tunable laser packages while maintaining performance and reliability, which is essential for broader applications, including various form factors in optical transceivers.
Innovation Solution
A small, packaged tunable laser design featuring a rectangular housing with a hermetically sealed interior space, including an electrical input interface, an optical output interface, a tunable semiconductor laser, and a focusing lens assembly, with dimensions allowing for volumes less than 0.6 cubic centimeters, enabling compact integration without compromising performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the size of tunable laser packages is reduced, then the laser can be used in a greater number of applications including various form factors, but the space for accommodating components and maintaining performance is compromised
Solution Approach 1:
The patent implements nesting by placing the tunable laser chip, lens assembly, and other optical components within a compact hermetic package where components are arranged in a nested configuration. The laser chip is positioned within a cavity that also contains the lens assembly, with components arranged to maximize space utilization while maintaining optical alignment, effectively fitting one component within or alongside another to minimize overall package volume.
Solution Approach 2:
The patent transitions from traditional lateral arrangement of components to a vertical stacking configuration along the optical axis. The laser chip, lens assembly, and hermetic seal are arranged in layers along the vertical dimension, allowing compact packaging in the horizontal plane while maintaining sufficient spacing for optical performance in the vertical dimension. This dimensional reorganization enables fitting components into limited space without compromising performance.
2Ease of manufacture
If the package size is reduced to fit form factors, then integration into optical transceivers is improved, but component placement and alignment become more difficult
Solution Approach 1:
The patent merges the laser chip, lens assembly, and mounting structure into a single integrated hermetic package. The lens is directly mounted on the laser chip substrate or positioned in immediate proximity within the same hermetic seal, eliminating the need for separate alignment procedures and reducing the number of assembly steps. This integration maintains precise optical alignment while simplifying the manufacturing process and enabling easy integration into optical transceivers.
3Volume of stationary object
If components are packed more densely, then the package volume is reduced, but the reliability and performance may be compromised
Solution Approach 1:
The patent employs a hermetic seal constructed from thin-walled metal or ceramic materials that provide reliable environmental protection while occupying minimal space. The hermetic seal creates an airtight enclosure around the optical components using thin film or shell structures that maintain structural integrity and protection against contamination without adding significant volume, thus enabling compact packaging while preserving component reliability and performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compact design allows for the use of tunable lasers in a wider range of applications, maintaining performance and reliability by efficiently fitting within limited spaces, such as pluggable optical transceivers and other module configurations.
Implementation Method 1
The beam splitter 401 directs a small portion (e.g., 5%) of the isolator output beam to the photodiode 402
Implementation Method 2
a photodiode 402 mounted on the surface of the base below the beam splitter 401
Implementation Method 3
The focusing lens assembly is positioned in the interior space along an optical path of the laser beam to operatively couple the laser beam to the optical output interface
Data Source
AI summary
According to one embodiment, the present application includes a tunable laser configured in a small package. The tunable laser includes a housing with a volume formed by exterior walls. An electrical input interface is positioned at the first end of the housing and configured to receive an information-containing electrical signal. An optical output interface is positioned at the second end of the housing and configured to transmit a continuous wave optical beam. A tunable semiconductor laser is positioned in the interior space and operable to emit a laser beam having a selectable wavelength. A focusing lens assembly is positioned in the interior space along an optical path of the laser beam to operatively couple the laser beam to the optical output interface.