Compact UV Sterilization Module With Direct-Mount LED Sealing
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Solution Overview
Problem
Conventional sterilization modules using UV light sources, such as mercury lamps, face challenges with miniaturization and leakage prevention, and often require larger sizes due to the use of LED packages which increase the distance between the light source and the transparent member, affecting sterilization efficiency and cost.
Innovation Solution
A sterilization module design featuring a light source unit with a light emitting diode chip mounted directly on a circuit board, utilizing a sealing member to create a compact structure with a transparent member and a waterproof resin to minimize size and prevent leakage, while maintaining effective UV transmission and sterilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mercury lamp is used for UV sterilization, then sterilization function is achieved, but environmental pollution increases due to mercury leakage
Solution Approach 1:
The patent extracts and eliminates the harmful mercury component from the sterilization system by replacing the mercury lamp with a mercury-free LED light source, thereby maintaining sterilization functionality while removing environmental pollution risks
Solution Approach 2:
The patent employs a solid-state LED light source that is environmentally friendly and free from hazardous materials like mercury, replacing traditional mercury lamps that require careful disposal due to their harmful contents
2Object-generated harmful factors
If LED packages are used to replace mercury lamps, then environmental friendliness is improved, but device size increases due to larger package structure
Solution Approach 1:
The patent extracts only the essential light-emitting semiconductor chip from the traditional LED package structure, eliminating unnecessary protective housing and mounting components that increase size, while maintaining the environmental benefits of LED technology
Solution Approach 2:
Instead of using a conventional approach where the chip is enclosed in a protective package, the patent inverts the design by directly mounting the exposed semiconductor chip onto the circuit board, achieving miniaturization while preserving LED environmental advantages
3Reliability
If traditional LED packages with protective tubes are used, then chip protection is improved, but distance between light source and transparent member increases, reducing sterilization efficiency
Solution Approach 1:
The patent removes the protective tube and housing from the LED package structure, exposing the semiconductor chip directly to minimize the distance to the transparent member, while implementing alternative protection methods that do not interfere with UV transmission
Solution Approach 2:
The patent inverts the traditional protective approach by placing the chip in direct contact with the circuit board and using the board itself as the protective and supportive structure, eliminating the need for separate protective tubes that would increase distance and reduce sterilization efficiency
4Volume of moving object
If chip is directly mounted on circuit board without protective structure, then miniaturization is achieved, but moisture ingress risk increases
Solution Approach 1:
The patent merges the circuit board with the protective and supportive functions, using the board's structure and materials to provide both electrical connection and environmental protection against moisture, thereby achieving miniaturization without compromising reliability
Solution Approach 2:
The patent employs composite material structures in the circuit board and sealing arrangements that provide both mechanical support and moisture barrier properties, protecting the exposed chip while maintaining the compact design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compact design enhances sterilization efficiency by reducing the distance between the light source and the transparent member, improves miniaturization, and reduces manufacturing costs by eliminating the need for separate spacers and protective tubes, while maintaining effective UV transmission and preventing moisture ingress.
Implementation Method 1
a light source unit irradiating ultraviolet light toward the transparent member, and wherein the light source unit includes a circuit board and a light emitting diode chip mounted on the circuit board
Implementation Method 2
a transparent member disposed on the ultraviolet outlet and configured to transmit ultraviolet light
Data Source
AI summary
A sterilization module including a main body, a circuit board disposed in the main body, a light source disposed on the circuit board to emit sterilizing light, and a transparent unit to protect the light source from an outside and including a material that transmits the sterilizing light, in which the light source includes a mesa including a first semiconductor layer, an active layer, and a second semiconductor layer, a first electrode electrically connected to the first semiconductor layer, and a second electrode disposed on the second semiconductor layer and electrically connected to the second semiconductor layer, in which the first electrode includes a first contact region disposed on the outer area of the first semiconductor layer and a second contact region at least partially surrounded by the mesa, and a distance between the transparent unit and the circuit board is greater than a height of the light source.


