Compact Vaporizer with Tortuous Flow Paths
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Solution Overview
Problem
In semiconductor applications, traditional methods for increasing vaporization rate, such as raising the operating temperature or enlarging the heat transfer surface, are not suitable due to thermal decomposition of metal-organic compounds and decreased responsiveness to changing vapor demands.
Innovation Solution
A compact vaporizer design utilizing a mixture of gas and liquid droplets flowing through heat exchangers with increased surface areas and tortuous flow paths for enhanced heat transfer, including a primary and secondary heat exchanger configuration with tubular flow passageways, to maintain high vaporization capacity at lower temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the operating temperature is increased to increase vaporization rate, then the vaporization rate is improved, but thermal decomposition of metal-organic compounds occurs causing process or equipment contamination
Solution Approach 1:
The heating process is divided into multiple stages using series-connected heat exchangers with progressively higher operating temperatures. The liquid precursor is vaporized in stages, with each heat exchanger operating at a controlled temperature below the decomposition point, allowing complete vaporization without thermal decomposition.
Solution Approach 2:
The system changes the temperature parameter progressively across multiple heat exchangers rather than using a single high-temperature heater. Each heat exchanger operates at a different temperature level, with the final stage reaching just below the decomposition temperature, enabling high vaporization rate without by-product formation.
2Productivity
If the heat transfer surface area is increased to increase vaporization rate, then the vaporization rate is improved, but the physical size of the apparatus increases making it less responsive to changing vapor demands
Solution Approach 1:
The total heat transfer surface area is segmented into multiple smaller heat exchangers connected in series. This segmentation allows the system to achieve high total vaporization capacity while maintaining a compact footprint, as each individual heat exchanger can be small but they collectively provide the necessary surface area.
Solution Approach 2:
The system transitions from a single large heat transfer surface to multiple distributed heat transfer surfaces arranged in series. This dimensional reorganization allows the apparatus to maintain high vaporization capacity while reducing the overall physical footprint and improving responsiveness to vapor demand changes.
3Productivity
If the heat transfer surface area is increased to increase vaporization rate, then the vaporization rate is improved, but the overall physical size of the apparatus increases
Solution Approach 1:
The heat transfer function is segmented across multiple compact heat exchangers connected in series. Each heat exchanger contributes a portion of the total heat transfer surface area, allowing the system to achieve high vaporization rates while maintaining a smaller overall apparatus volume compared to a single large heat exchanger.
Solution Approach 2:
The heat exchangers are arranged in a nested or compact series configuration where the output of one feeds into the next. This nesting approach allows multiple heat transfer surfaces to be packed into a smaller overall volume, achieving high vaporization capacity without proportionally increasing apparatus size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient vaporization at lower temperatures, maintaining a high vaporization capacity while keeping the apparatus compact and responsive, reducing the formation of undesirable by-products and improving response speed.
Implementation Method 1
flowing a mixture of gas and liquid droplets for vaporization through at least one heat exchanger having a plurality of surfaces for heat transfer to the gas
Implementation Method 2
heat can be conducted more easily into the liquid
Implementation Method 3
heat transfer to the gas, the increased surface area in the heat exchanger directing the gas and liquid mixture through a tortious flow path
Implementation Method 4
heating the liquid to a sufficiently high temperature to cause the liquid to undergo a phase change and become a vapor
Implementation Method 5
vapor generation that allows for a more compact vaporizer design, while reducing the maximum temperature to which the liquid and vapor are exposed to
Data Source
AI summary
An apparatus and method for generating a vapor with a compact vaporizer design and exposing the gas and liquid mixture for vaporization to a reduced maximum temperature. A gas and liquid droplet flow through a metal housing configured to heat the gas and liquid droplet mixture flow for vaporization includes directing the gas and liquid droplet mixture through an inlet of the metal housing and flowing the gas through a tortious flow path defined by a plurality of tubular flow passageways arranged around a central axis for vaporization. The flow path is directed through a heat exchanger including one more changes in direction of flow path before flowing into the further tortious flow path described above. Residual liquid droplets may be further vaporized by flowing through a second metal housing configured to heat the gas and liquid droplet mixture for vaporization and having a similar construction to the first metal housing and providing a second tortious flow path.