Compact Vaporizer Using Tortuous Flow Paths for Semiconductor Deposition

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Solution Overview

Problem

In semiconductor applications, traditional methods for increasing vaporization rate, such as raising the operating temperature or enlarging the heat transfer surface, are not suitable due to thermal decomposition of metal-organic compounds and decreased response speed, respectively.

Innovation Solution

A compact vaporizer design utilizing a mixture of gas and liquid droplets flowing through heat exchangers with increased surface areas and tortuous flow paths for enhanced heat transfer, including a primary and secondary heat exchanger configuration with tubular flow passageways, to achieve high vaporization capacity at lower temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the operating temperature is increased to increase vaporization rate, then the vaporization rate is improved, but thermal decomposition of metal-organic compounds occurs causing process or equipment contamination

Engineering Contradiction:
Improvevaporization rateVSAvoidthermal decomposition and by-product formation
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The vaporization process is divided into multiple stages using a two-stage heat exchanger system. The first heat exchanger performs initial vaporization at lower temperatures, while the second heat exchanger completes the vaporization process. This segmentation allows the liquid to be vaporized in steps rather than exposed to high temperatures all at once, preventing thermal decomposition.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Instead of increasing temperature in one dimension, the patent increases the heat transfer surface area by creating tortuous flow paths through coiled tubes and multiple passes. This adds spatial complexity to the heat transfer process, allowing more surface area contact without raising the temperature, thus avoiding thermal decomposition while maintaining high vaporization rate.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If the heat transfer surface area is increased to increase vaporization rate, then the vaporization rate is improved, but the physical size of the apparatus increases making it less responsive to changing vapor demands

Engineering Contradiction:
Improvevaporization rateVSAvoidapparatus size
Core Design Contradiction:
ProductivityVSLength of stationary object

Solution Approach 1:

The patent uses coiled or helical tubes within the heat exchangers to create tortuous flow paths. This curved geometry packs more heat transfer surface area into a compact volume compared to straight tubes, increasing the vaporization rate without proportionally increasing the apparatus size. The coiled configuration allows the liquid to traverse a longer path through the heating zone within a smaller footprint.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The heat exchanger tubes are nested within a compact housing structure, with multiple tubes arranged in parallel or series configurations. This nesting allows multiple heat transfer surfaces to occupy overlapping spatial volumes, maximizing the heat transfer area within a minimized external dimensions, thus maintaining compactness while achieving high vaporization capacity.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Productivity

If the heat transfer surface area is increased to increase vaporization rate, then the vaporization rate is improved, but the response speed of the apparatus decreases

Engineering Contradiction:
Improvevaporization rateVSAvoidresponse speed
Core Design Contradiction:
ProductivityVSSpeed

Solution Approach 1:

The patent employs multiple smaller heat transfer surfaces distributed throughout the apparatus rather than one large surface. This allows different regions of the system to be optimized for different functions - some areas for rapid heating response, others for complete vaporization. The modular arrangement enables faster response to changing vapor demands while maintaining high overall vaporization capacity.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for efficient vaporization of liquid droplets in a gas with a smaller, more responsive apparatus, maintaining high vaporization capacity while minimizing thermal decomposition and maintaining low maximum temperatures.

Implementation Method 1

flowing a mixture of gas and liquid droplets for vaporization through at least one heat exchanger having a plurality of surfaces for heat transfer to the gas

Methodology Applied
Scientific EffectHeat transfer: Heat Exchanger

Implementation Method 2

heat can be conducted more easily into the liquid

Methodology Applied
Scientific EffectConduction (thermal): Conduction (thermal)

Implementation Method 3

The flow path may comprise a plurality of metal tubes within the first heat exchanger

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 4

heating the liquid to a sufficiently high temperature to cause the liquid to undergo a phase change and become a vapor

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 5

vapor generation that allows for a more compact vaporizer design

Methodology Applied
Scientific EffectEvaporation: Evaporation

Data Source

PatentUS9797593B2Apparatus and method for vapor generation and film deposition
Publication Date: 2017.10.24 MSP CORP
  • US9797593B2 patent drawing
  • US9797593B2 patent drawing
  • US9797593B2 patent drawing

AI summary

An apparatus and method for generating a vapor with a compact vaporizer design and exposing the gas and liquid mixture for vaporization to a reduced maximum temperature. A gas and liquid droplet flow through a metal housing configured to heat the gas and liquid droplet mixture flow for vaporization includes directing the gas and liquid droplet mixture through an inlet of the metal housing and flowing the gas through a tortious flow path defined by a plurality of tubular flow passageways arranged around a central axis for vaporization. Residual liquid droplets may be further vaporized by flowing through a second metal housing configured to heat the gas and liquid droplet mixture for vaporization and having a similar construction to the first metal housing and providing a second tortious flow path.