Compartment EMI Shield for SiP Modules
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Solution Overview
Problem
Current EMI shielding solutions for system-in-a-package (SiP) modules, such as electrically-conductive metal cans, are impractical due to space constraints in modern electronic devices like smartphones, as they fail to effectively shield radio frequency (RF) functional blocks from interfering with each other within the module package.
Innovation Solution
A compartment EMI shield comprising a conductive fence and substantially vertical conductive structures arranged along the compartment boundary, which are electrically coupled to a common ground structure, effectively attenuate EMI between RF functional blocks without occupying excessive space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electrically-conductive metal cans are used for EMI shielding of RF functional blocks, then EMI attenuation is improved, but device size and space requirements increase
Solution Approach 1:
The patent divides the EMI shielding function into segmented conductive structures (conductive fences and vertical conductive structures) that are distributed along compartment boundaries rather than using a single enclosing can. This segmentation provides effective EMI attenuation while occupying minimal space within the module package.
Solution Approach 2:
The patent transitions from traditional three-dimensional enclosing shields to two-dimensional conductive fences and vertical structures that extend along compartment boundaries. This dimensional change maintains EMI shielding effectiveness while dramatically reducing the volume occupied by shielding structures.
2Reliability
If traditional EMI shielding structures are used, then RF component protection is improved, but integration density decreases
Solution Approach 1:
The patent merges the EMI shielding function with the existing compartment boundary structures. The conductive fences and vertical conductive structures are integrated along compartment boundaries, combining structural definition with EMI protection functions, thereby increasing integration density without compromising RF component protection.
Solution Approach 2:
The conductive structures serve multiple functions: they provide EMI shielding, define compartment boundaries, and establish electrical ground connections. This multi-functionality increases integration density by eliminating the need for separate shielding and structural elements.
3Reliability
If compartment EMI shielding is added to SiP modules, then operational stability of RF components is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies EMI shielding with local quality by placing conductive fences and vertical conductive structures specifically at compartment boundaries where EMI interference occurs between RF functional blocks. This localized approach provides operational stability without the manufacturing complexity of comprehensive shielding throughout the entire module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compartment EMI shield provides effective EMI attenuation within the module package, accommodating thinner form factors and smaller dimensions of SiP modules, thereby enhancing the operational stability of RF components without increasing the package size.
Implementation Method 1
A compartment EMI shield comprising a conductive fence and substantially vertical conductive structures arranged along the compartment boundary, which are electrically coupled to a common ground structure, effectively attenuate EMI between RF functional blocks
Data Source
AI summary
A compartment EMI shield is provided that is suitable for use in system module packages having thin form factors and/or smaller widths and/or lengths. The compartment EMI shield comprises a fence arranged along a compartment boundary at least in between first and second sets of electrical components of the system module package and a substantially horizontal conductive structure that is coupled to the conductive fence. The fence being configured to attenuate EMI of a frequency of interest traveling in at least one of a first direction and a second direction, where the first direction is from the first set of electrical components toward the second set of electrical components and the second direction is from the second set of electrical components toward the first set of electrical components.