Compartment Metal Frame Shielding for Semiconductor Package EMI
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Solution Overview
Problem
Existing semiconductor package shielding methods are complex, costly, and prone to durability issues, such as peeling, and limit thermal release due to the use of encapsulants and trenching processes, which are ineffective in managing electromagnetic interference (EMI) and thermal budgets.
Innovation Solution
A semiconductor device is formed using a metal frame and cap to create a compartmentalized shielding mechanism that eliminates the need for encapsulants, reducing complexity and enhancing durability by using a metal frame and lid to surround and compartmentalize components, thereby reducing intra-package interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive layers are sputtered onto molding compound to form shielding layers, then EMI shielding is achieved, but the shielding layer has durability issues and is susceptible to peeling off
Solution Approach 1:
The patent extracts the shielding function from the molding compound surface and relocates it to a metal frame structure positioned around the semiconductor components. This separates the shielding function from the encapsulant, eliminating the peeling issue while maintaining EMI protection.
Solution Approach 2:
The patent introduces a metal frame as an intermediary structure between the semiconductor components and the external environment. This frame serves as the actual shielding element, mediating the EMI protection function without relying on adhesion to the molding compound.
2Reliability
If trenching of the encapsulant is performed to form shielding layers, then intra-package EMI shielding is achieved, but the manufacturing process becomes complicated and costly
Solution Approach 1:
The patent segments the shielding function into a separate metal frame structure that can be independently manufactured and positioned. This eliminates the need for complex trenching operations in the encapsulant, as the shielding is provided by the modular frame around the components.
Solution Approach 2:
Instead of modifying the encapsulant to create shielding (trenching and filling), the patent inverts the approach by placing a metal frame structure around the components. This reverses the conventional sequence and simplifies manufacturing.
3Reliability
If encapsulant is used to encapsulate components, then components are protected, but thermal release of the underlying components is limited
Solution Approach 1:
The patent replaces the thick encapsulant with a thin metal frame structure that provides protection while maintaining thermal conductivity. The frame acts as a flexible protective shell that does not impede heat flow from the underlying components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metal frame and cap shielding solution simplifies the manufacturing process, enhances durability, and improves thermal management while effectively reducing electromagnetic interference, making semiconductor devices more reliable and cost-effective.
Implementation Method 1
A semiconductor device and method of forming a shielded semiconductor device using compartment shielding with a metal frame and cap
Data Source
AI summary
A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A first metal frame is disposed over the substrate around the first semiconductor die. A first metal lid is disposed over the first metal frame. A flap of the first metal lid includes an elastic characteristic to latch onto the first metal frame. An edge of the flap can have a castellated edge. A recess in the first metal frame and a protrusion on the first metal lid can be used to latch the first metal lid onto the first metal frame. A second metal frame and second metal lid can be disposed over an opposite surface of the substrate from the first metal frame.